Hybrid Memory Cube

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Hybrid Memory Cube

A memory module technology from the Hybrid Memory Cube Consortium (HMCC), spearheaded by Micron and Samsung, that stacks chips vertically rather than horizontally. Finalized in 2013, Hybrid Memory Cubes (HMCs) provide 15 times the bandwidth of DDR3 chips while consuming 70% less power and 90% less space. Like DRAM, HMCs lose their content without power.

Initially used in supercomputers and high-speed servers, HMC memory is expected to migrate to all types of computing devices. See dynamic RAM, memory module and via.

3D Stacking
DRAM layers are stacked over a logic layer and connected with "vias" (corner cutout) that run through the silicon. This compact architecture is faster and more energy efficient than conventional DRAM modules. (Image courtesy of the HMC Consortium, www.hybridmemorycube.org)
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The technology is called Matrix 3-D Memory, since the card is created by building a semiconductor product in three dimensions, which decreases the wafer area of each chip to achieve significant cost reduction.
a leading developer of embedded systems and software for digital media devices, today announced it has incorporated Matrix(TM) 3-D Memory technology from Matrix Semiconductor in its popular Symphony(TM) embedded system for portable digital consumer electronics products, helping to achieve the lowest-possible cost for such devices.
How big is this 3-D memory market going to be and at which conditions?
Matrix(R) 3-D Memory is used for storage applications that do not require multiple rewrites and where low cost is the paramount consideration, such as video games, music and other content, or for archiving.
Accelerating the availability of high quality content for mobile devices, Motricity, the world's leading mobile content and solutions provider, and Matrix Semiconductor, the premier memory supplier to mobile content markets, today announced that the companies are working together to deliver high quality mobile content on Matrix(R) 3-D Memory based MMC and miniSD cards commonly used by mobile operators, handset manufacturers and retailers to bring rich content and multimedia applications to consumers.
Matrix(R) 3-D Memory miniSD Cards Currently Sampling in 16 and 32 MB Capacities for Distribution of Pre-Recorded Content on Mobile Consumer Electronics Devices
Matrix Semiconductor today announced it is has further strengthened the company's global sales efforts for its Matrix(R) 3-D Memory (3DM) products by signing distribution agreements with leading companies covering the Asia Pacific (APAC) market.
Starting immediately, INNOTECH Corporation will act as an official manufacturer's representative for the Matrix(R) 3-D Memory (3DM) product line in Japan, offering manufacturers and designers of consumer electronic devices local sales support through INNOTECH's experienced sales and technical teams.
Matrix will continue to double density with each new version of its 3-D memory for years to come, providing high capacities at the lowest absolute silicon cost.
The one-hundredth patent describes the Segmented Wordline architecture developed for Matrix(R) 3-D Memory (3DM).
As a Platinum Partner, Matrix is extending its first product, Matrix(R) 3-D Memory (3DM) -- a cost-effective, programmable, permanent, non-volatile memory used in publishing content for mobile devices -- to the Symbian OS ecosystem.
As Matrix Semiconductor continues to pursue the market for mobile content publishing using Matrix(R) 3-D Memory, the Company strongly believes that it will benefit from the years of relevant insight and experience that Mr.