BGA


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BGA

Ball Grid Array

BGA

(Ball Grid Array) A popular surface mount chip package that uses a grid of solder balls as its connectors. Available in plastic and ceramic varieties, BGA is noted for its compact size, high lead count and low inductance, which allows lower voltages to be used. BGA chips are easier to align to the printed circuit board, because the leads, which are called "solder balls" or "solder bumps," are farther apart than leaded packages. Since the leads are underneath the chip, BGA has led the way to chip scale packaging (CSP) where the package is not more than 1.2x the size of the semiconductor die itself. See surface mount, chip package, MicroBGA and flip chip.


BGA Solder Balls
These are the undersides of BGA packages showing the solder balls. The small one on the ruler is a µBGA (MicroBGA) chip from Tessera. Using the entire square of the chip package for leads is an advantage of the BGA method. (Image samples courtesy of Amkor Technology, Inc.)







BGA Package Types
These cross sections show BGA packages in standard and CSP varieties. (Illustrations courtesy of Joseph Fjelstad.)








Different Contact Types
The solder balls can be made to connect to the printed circuit board using various contact methods as illustrated here. (Illustrations courtesy of Joseph Fjelstad.)


Different Contact Types
The solder balls can be made to connect to the printed circuit board using various contact methods as illustrated here. (Illustrations courtesy of Joseph Fjelstad.)
References in periodicals archive ?
The mission-critical task of assessing which BGA is the right one for you can be one of the most important business decisions you are likely to face.
4mm pitch BGA PCB design using NSMD pad sizes, where in a low-volume run the results were highly acceptable.
The BGA will continue to exist but will now operate in a less formal manner and without the existence of the annual reunion.
The advisory prompted calls from consumers of UKL BGA products, who expressed concern about the possible contamination of these products with microcystin toxins.
Uniform heating of the part with auxiliary heating is necessary to avoid localized thermal shock to the BGA from the hot blade.
Founded in 1923 by a group of citizens concerned about government corruption, the BGA is a nonpartisan nonprofit organization committed to fighting waste, corruption and inefficiency in state and local government.
Coplanarity of the bottom package against the substrate becomes an issue as the corner edges of the BGA warp in a concave manner, causing loss of contact between the BGA ball and substrate.