BGA


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BGA

Ball Grid Array

BGA

(Ball Grid Array) A popular surface mount chip package that uses a grid of solder balls as its connectors. Available in plastic and ceramic varieties, BGA is noted for its compact size, high lead count and low inductance, which allows lower voltages to be used. BGA chips are easier to align to the printed circuit board, because the leads, which are called "solder balls" or "solder bumps," are farther apart than leaded packages. Since the leads are underneath the chip, BGA has led the way to chip scale packaging (CSP) where the package is not more than 1.2x the size of the semiconductor die itself. See surface mount, chip package, MicroBGA and flip chip.


BGA Solder Balls
These are the undersides of BGA packages showing the solder balls. The small one on the ruler is a µBGA (MicroBGA) chip from Tessera. Using the entire square of the chip package for leads is an advantage of the BGA method. (Image samples courtesy of Amkor Technology, Inc.)







BGA Package Types
These cross sections show BGA packages in standard and CSP varieties. (Illustrations courtesy of Joseph Fjelstad.)








Different Contact Types
The solder balls can be made to connect to the printed circuit board using various contact methods as illustrated here. (Illustrations courtesy of Joseph Fjelstad.)


Different Contact Types
The solder balls can be made to connect to the printed circuit board using various contact methods as illustrated here. (Illustrations courtesy of Joseph Fjelstad.)
References in periodicals archive ?
The laser was only able to create an acceptable profile for the 1849 pin BGA on Test Vehicle 3 by directing the laser beam onto the package and the board due to the construction of the BGA; however, this practice resulted in excessive heating of the board.
Acoustic Technologies, a leading developer of high quality full-duplex voice processing solutions, announced the release of their patented SoundClear[R] technology in a small 5mm by 5mm BGA package.
Leftover solder is commonly removed from the site after rework, but prepping the pads, depositing fresh solder paste, placing the new BGA and heating the board takes time.
Arguably, as the BGA was the first commonly used component to be placed on boards with all its interconnections hidden from any possibility of post-reflow optical inspection, I suggest the BGA has been the primary driver for the increased uptake of x-ray inspection in recent years.
Works with devices like 121 BGA, 12 mm square package with 11x11 array and 1 mm pitch
The socket is constructed with an open-top lid for access to the center of the IC package and comes with a ball guide for the precise alignment of BGA balls to PCB pads.
To use, place the BGA device into the socket base and tighten the open top lid using four screws.
Before starting your quest for the perfect BGA to fit your profile, make a list -- an old-fashioned paper and pencil deal -- of what the deliverables must be.
BGA is headquartered in Oakland and offers customers a comprehensive range of engineering services, catering to the needs of power generation, energy delivery, architecture and commercial building operators, among others.
BGA, which is owned by local mineral exploration company PT Harita Jayaraya, will use the proceeds from the floatation for loan repayments and for expansion of its land bank and oil palm plantations, BGA said.