ball bonding


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ball bonding

[′bȯl ‚bänd·iŋ]
(engineering)
The making of electrical connections in which a flame is used to cut a wire, the molten end of which solidifies as a ball, which is pressed against the bonding pad on an integrated circuit.
References in periodicals archive ?
Soldering a head slider to a tongue surface can be achieved by using gold ball bonding (GBB) or solder ball bonding (SBB).
In recent years, K/S has expanded its product offerings through strategic acquisitions and organic development, adding advanced packaging, advanced SMT, wedge bonding and a broader range of expendable tools to its core ball bonding products.
Characterization and Modeling of Fine-Pitch Copper Ball Bonding on a Cu/Low-k Chip"
Rodrigues, "Simulation of Ball Bonding on Various Bond Pad Structures", Proceedings of IEEE 14th Electronics Packaging Technology Conference, EPTC 2013, Singapore, Dec.
There were work done [6 & 7] on gold ball bonding adhesion is influenced by both ultrasonic force and time of the process, the studies were done on aluminium bond pad, surface roughness effect were not discussed except on the native oxide formation on the bonding surface.
Wedge bonding can achieve finer pad pitch geometries than ball bonding with the same wire diameter because of the smaller amount of bond "squash" or wire deformation.
The consumer market demand for smaller and more complex electronic devices is driving the wire bonding industry to set new ball bonding limits.
Processes include high accuracy component assembly with eutectic solder or epoxy, precision ball bonding, and wedge bonding for fine pitch devices, as well as epoxy, laser weld and solder based attachment of actively aligned photonic devices.
Figure 6 shows a relationship for impact force and static bond force with bond pad cratering for thermosonic ball bonding.
In recent years, K&S has expanded its product offerings through strategic acquisitions, adding wedge bonding and a broader range of expendable tools to its core ball bonding products.
Gold is the most widely used metal for IC wire bonding because of its resistance to surface corrosion and high productivity through the gold ball bonding process.
Gold is used because it is normally inert, well suited to the ball bonding process and demonstrates excellent loop formation and cycle performance.