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wire bonding
(redirected from Bond wire)

   Also found in: Wikipedia 0.01 sec.
wire bonding [′wīr ‚bänd·iŋ]
(electricity)
Lead-covered tie used to connect two cable sheaths until a splice is permanently closed and covered.
(electronics)
A method of connecting integrated-circuit chips to their substrate, using ultrasonic energy to weld very fine wires mechanically from metallized terminal pads along the periphery of the chip to corresponding bonding pads on the substrate.
The attachment of very fine aluminum or gold wire (by thermal compression or ultrasonic welding) from metallized terminal pads along the periphery of an integrated circuit chip to corresponding bonding pads on the surface of the package leads.


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It is even possible to perform a pattern recognition step between each bond wire.
In addition, COC cannot use same-size or overlapping die because these chip placements interfere with bond wires between the PCB and the lower IC die.
The technology itself provides a simple technique for a wide variety of high-magnification X-ray applications to analyze such defects as fine bond wire cracks or tiny voids that occur in flip chip solder balls of merely 25 microns in diameter and display at this extremely high resolution.
 
 
 
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