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wire bonding
(redirected from Bond wire)

   Also found in: Wikipedia 0.02 sec.
wire bonding [′wīr ‚bänd·iŋ]
(electricity)
Lead-covered tie used to connect two cable sheaths until a splice is permanently closed and covered.
(electronics)
A method of connecting integrated-circuit chips to their substrate, using ultrasonic energy to weld very fine wires mechanically from metallized terminal pads along the periphery of the chip to corresponding bonding pads on the substrate.
The attachment of very fine aluminum or gold wire (by thermal compression or ultrasonic welding) from metallized terminal pads along the periphery of an integrated circuit chip to corresponding bonding pads on the surface of the package leads.


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In applications such as this, the extremely precise die position relative to other die in the assembly defines an accurate bond wire length (and therefore resistance) and capacitance and inductance (wire loop control) that can become a predictable and reliable part of the RF design.
4 reportedly contains more robust, sophisticated algorithms for faster processing, and bond wire optimization and 3D design tools that help reduce design time, improve overall time-to-market and improve yields.
The integration of our technology with MKE's leading bonding wires offers the industry another reliable source of insulated bond wire for use in an expanding array of existing and new chip and package designs, leading to yield improvements, package size reductions, performances enhancements and cost savings.
 
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