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In addition, ASMPT was selected by one of the top ten semiconductor manufacturers as their sole wire bonder supplier, after running several months in parallel evaluation with their existing supplier.
The ELAN was designed with customers exactly like NanoWorld in mind," says Michael Kipp, President, Wafer Bonder Division, SUSS MicroTec, Waterbury, Vermont, USA.
5, 2013 /PRNewswire-iReach/ -- Palomar Technologies, the world-leading provider of precision microelectronics and optoelectronic packaging systems, today announced live demonstrations of a new wire bonder at productronica 2013: the 8000i Wire Bonder with Intelligent Interactive Graphical Interface[sup.
Specifically, SUSS MicroTec has supplied IMEC with a FC150 Automated Device Bonder to perform all bonding tests realized in the frame of this one-year research program.
It was an integrated circuit wire bonder, developed in 1972, and was the first mass-produced, automated production tool for the assembly of integrated circuits.
Palomar Technologies, leader in precision automation equipment and process development for microelectronic assembly, presents the latest version of its award-winning automatic die bonder, the Model 3500-III.
This is achieved by maintaining high vacuum in the bonder chamber at all times by means of a secondary load lock chamber and by heating the vacuum chamber walls to reduce the effect of outgassing during wafer bonding.
Expensive automatic bonders have pattern recognition systems that look at the chip while it is sitting in the carrier, memorize the emission point's location and coordinate that with the landing site on the submount.
Krauss-Maffei also showed its DVD hot-melt bonder with a 3.
ConnX Plus is a second generation ball bonder under the successful Power Series (TM).
Bonder program developers and operators experience real-time bonding and part quality validation.
With over 6,000 systems installed, SUSS products include coating and developing systems, proximity lithography systems, substrate bonders, flip chip bonders and probe systems.