Czochralski process

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Czochralski process

[chə′kräl·skē ‚präs·əs]
(crystallography)
A method of producing large single crystals by inserting a small seed crystal of germanium, silicon, or other semiconductor material into a crucible filled with similar molten material, then slowly pulling the seed up from the melt while rotating it.
References in periodicals archive ?
the report has introduced wafer and ingot manufacturing process (DSS,FZ CZ process, multi-wire cutting etc), wafer or ingot Equipments (ingot furnace Puller equipment suppliers and their equipment specifications),raw materials (polysilicon SIC PEG WIRE suppliers and average selling price), processing cost (ingot processing cost and cutting processing cost), finally, the report also introduced 200MW wafer project Feasibility analysis and related research conclusions.
In addition, the report examines the wafer and ingot manufacturing processes (DSS, FZ CZ process, multi-wire cutting etc), wafer or ingot equipment (equipment suppliers and their equipment specifications), raw materials (polysilicon suppliers and average selling price), processing costs (ingot processing cost and cutting processing cost), and a 100MW wafer project feasibility analysis.
In addition to this the report examines wafer and ingot manufacturing process (DSS,FZ CZ process, multi-line cutting etc), wafer or ingot Equipments(equipment suppliers and their equipment specifications), raw materials (polysilicon suppliers and average selling price), processing cost (ingot processing cost and cutting processing cost).