Study Reliability and Reporting Limitations I-1 Disclaimers I-2 Data Interpretation & Reporting Level I-2 Quantitative Techniques & Analytics I-3 Product Definitions and Scope Of Study I-3 Ball Grid Arrays I-3 Chip Scale Packaging
(CSP) I-3 Multi Chip Modules (MCM) I-3
Epson"), world leader in printing and imaging products, has purchased an MA200Compact Mask Aligner from SUSS MicroTec (FWB:SMH)(GER:SMH), the leading supplier of precision manufacturing and test systems, to support their Wafer Level Chip Scale Packaging
Staccato leverages well-established manufacturing expertise of wafer level chip scale packaging
to achieve a level of size, cost and integration that is unprecedented for an Ultra Wideband solution.
We are honored that one of the leading Taiwanese chip scale packaging
service providers has decided to develop its innovative packaging solutions on SUSS equipment" comments Rolf Wolf, managing director for SUSS Micro Tec's lithography division.
We believe that the growth of the flip chip market, and the increased adoption of flip chip packaging and its close relative, chip scale packaging
for logic, memory and cell phone chipsets, will continue to drive manufacturing capacity expansion through 2009.
Its System in Package (SIP) support for advanced packaging includes multi-chip modules, molded chip packages, chip on board solutions, chip scale packaging
, and other small form factor printed circuit board assemblies.
MEI, best known for its 'Panasonic' brand, utilizes Tessera's chip scale packaging
(CSP) technology in many semiconductor devices, including application specific standard products (ASSPs), application specific integrated circuits (ASICs), and various logic devices.
Latest Intel(R) Stacked Chip Scale Packaging
Unitive's services include multi-level passivation and thin film wiring, solder bumping, and chip scale packaging
We expect that this expertise will serve our future customers in wafer level chip scale packaging
(WLCSP) applications very well," McKibben said.
The process line will provide ACE with advanced packaging equipment technology to further enhance its position in the Wafer Level Chip Scale Packaging
market place and position it as a leader in the high potential Chinese market.
SPIL's utilization of K&S technology for its wire bonded, flip chip and chip scale packaging
requirements exemplifies our strategic plan to offer a full complement of semiconductor interconnect solutions," Rheault said.