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Chip Scale Packaging

   Also found in: Wikipedia 0.04 sec.
(hardware)Chip Scale Packaging - (CSP) A type of surface mount integrated circuit packaging that provides pre-speed-sorted, pre-tested and pre-packaged die without requiring special testing. An example is Motorola's Micro SMT packaging.

See also: chip-on-board, flip chip, multichip module, known good die, ball grid array.

["Chip scale packaging gains at SMI. (Surface Mount International)", Bernard Levine, Electronic News (1991), Sept 4, 1995 v41 n2081 p1(2)].


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Epson"), world leader in printing and imaging products, has purchased an MA200Compact Mask Aligner from SUSS MicroTec (FWB:SMH)(GER:SMH), the leading supplier of precision manufacturing and test systems, to support their Wafer Level Chip Scale Packaging (W-CSP) production.
Epson Selects MA200Compact Mask Aligner from SUSS MicroTec for Wafer ... by Business Wire
The widespread use of packaging technologies such as chip scale packaging (CSP) and ball grid arrays (BGAs) in electronics manufacturing, makes it vital for inspection system companies to realign their product development strategy to keep pace with such sophisticated technology.
Inspection System Market Compelled to Keep Pace with Advancements in ... by Business Wire
MEI, best known for its 'Panasonic' brand, utilizes Tessera's chip scale packaging (CSP) technology in many semiconductor devices, including application specific standard products (ASSPs), application specific integrated circuits (ASICs), and various logic devices.
Tessera and Matsushita Sign Technology Licensing Agreement by Business Wire
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