chip carrier

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chip carrier

(1) The package that a chip is mounted in. See chip package.

(2) A chip package with connectors on all sides. See leaded chip carrier and leadless chip carrier.


An Old Chip Package
Chips like this old Motorola 6801 microcontroller used to be packaged in a housing with pins that plugged into a circuit board. Today most chips are soldered on top of the board (see QFP and BGA).
References in periodicals archive ?
rex 541 for use by customers who extrude sheets and films that can be thermoformed to finished components, saying that it is "ideal for applications in several industries": medical--for use in sterilizable trays and equipment; aerospace--meets flame, smoke and toxicity requirements for use in aircraft interior applications; and semiconductor--provides high stiffness and a low coefficient of thermal expansion for use in chip carriers.
ASAT's advanced package portfolio includes standard and high thermal performance ball grid arrays, leadless plastic chip carriers, thin array plastic packages, system-in-package and flip chip.
A grade of DSM's Stanyl nylon 46 has been introduced for lead chip carriers for high brightness LEDs such as found in back lighting LCD display panels for mobile phones, PDAs, notebook PCs and hand held devices.
is aimed at high-brightness LEDS used in chip carriers for mobile phones, PDAs, and notebook PCs.
DSM Engineering Plastics has announced the launch of Stanyl LED (light emitting diodes) 1551, the latest grade of Stanyl used in plastic lead chip carriers (PLCC) for high-brightness LEDs.
2] were joined to organic buildup chip carriers and subjected to a battery of tests.
These batteries can be fabricated on a variety of substrates as well as onto chips, chip carriers or multi-chip module packages.
ASAT technology services include standard and thermally enhanced leaded packages, chipscale packages, standard and high thermal performance ball grid arrays, leadless plastic chip carriers (LPCC(TM)), thin array plastic packages (TAPP(R)), system-in-package, stacked die and flip chip.
Applications for the system include ball grid arrays (BGA), micro-BGAs, chip-scale packages (CSPs), flip chip, multi-chip module (MCM) bump-on-die, lead frames, solder paste and chip carriers.
Applications include automotive engine components, chip carriers, and gears.
The inside of a typical personal computer, for example, contains dual-in-line packages (DIPs), plastic-leaded chip carriers (PLCCs), and plastic pin-grid arrays (PPGAs) for chip carriers.
LE20 and LE40 accurately place virtually all surface-mount components--including discretes, small-outline integrated circuits (SOICs), plastic leaded chip carriers (PLCCs), quad flat packs (QFPs) and ball grid arrays (BGAs)--from interchangeable tape, tube, bulk or tray feeders.