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chip package

   Also found in: Wikipedia 0.01 sec.
chip package
The housing that chips come in for plugging into (socket mount) or soldering onto (surface mount) the printed circuit board. Creating a mounting for a chip might seem trivial to the uninitiated, but chip packaging is a huge and complicated industry. The ability to provide more and more I/O interconnections to a die (bare chip) that is increasingly shrinking in size is an ever-present problem. In addition, the smaller size of the package contributes as much to the miniaturization of cellphones and other handheld devices as the shrinking of the semiconductor circuits. See CDIP, CERDIP, CERQUAD, CLCC, DIP, flatpack, PLCC, QFP, MCM, MCP, SOP, SOIC, SOJ, TSOP and ZIP.


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The wire-bonding machine employs insulated bonding wire to prevent short circuits with the chip package, and U2 is then sent to the board assembler who uses standard SMT assembly practices to mount components and complete the board assembly.
123-38A/B-187 is a thermally conductive underfill epoxy that strengthens the chip package and protects it from moisture.
The Paper Thin Package (PTP) technology reduces the size of stacked chip packages by shrinking the width of the individual stacked ICs.
 
 
 
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