SAN DIEGO -- Staccato Communications, an Ultra Wideband (UWB) wireless technology pioneer and Certified Wireless USB leader, today unveiled the industry's only Wafer Chip Scale Package (WCSP) based on Staccato's Ripcord[TM] single-chip, all-CMOS solution.
The Ripcord[TM] SC3500 product family is offered in two packaging options, a complete System-In-Package (SiP) which provides a fully-integrated solution for simplified RF design and a high degree of manufacturability, and a Wafer-Level Chip Scale Package (WCSP) which provides a low-cost, small-form-factor option for module manufacturers and OEMs that have in-house RF expertise.
The AD8337 is housed in a tiny 3 mm x 3 mm, 8-lead chip scale package
(CSP) that occupies one-third less board area than alternatives.
Our proprietary Chip Scale Package stacking technology allows us to double, triple or quadruple the capacity of DDR1 and DDR2 DRAMs within the JEDEC-standard form factor," said Paul Goodwin, director of business development at Staktek.
Nasdaq:STAK), a major provider of high-density packaged memory stacking solutions, today announced at Denali MemCon San Jose the availability of its High Performance Stakpak(R) for stacking DDR2 and DDR1 DRAMs in Chip Scale Packages.
Pre-production quantities of the High Performance Stakpak are currently available for DDR2 and DDR1 DRAMs in Chip Scale Packages, and production quantities will be available in Q1 CY05.
Table 16: World Recent Past, Current & Future Analysis for Chip Scale Packages by Geographic Region - US, Canada, Japan, Europe, Asia-Pacific (excluding Japan), and Rest of World Markets Independently Analyzed with Annual Revenues in US$ Million for Years 2000 through 2010 (includes corresponding Graph/Chart) II-39
Table 17: World Long-Term Projections for Chip Scale Packages by Geographic Region - US, Canada, Japan, Europe, Asia-Pacific (excluding Japan), and Rest of World Markets Independently Analyzed with Annual Revenues in US$ Million for Years 2011 through 2015 (includes corresponding Graph/Chart) II-40
Table 18: World 10-Year Perspective for Chip Scale Packages by Geographic Region - Percentage Breakdown of Dollar Revenues for US, Canada, Japan, Europe, Asia-Pacific (excluding Japan), and Rest of World Markets for Years 2003, 2008 & 2012 (includes corresponding Graph/Chart) II-41
It supports a wide variety of BGA formats including single devices in boats or trays and strip devices in magazines with the capability to process chip scale packages
, plastic ball grid array, ceramic ball grid array, tape grid array, and connector package types.
Tegal has developed a suite of processes for the plasma etch of a variety of metal films incorporated in chip scale packages
Nasdaq: AMKR) announced today that it is the first to qualify a family of two die Stacked Chip Scale Packages
(S-CSP) to meet 1.