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Chip Scale Packaging
(redirected from Chip scale package)

   Also found in: Acronyms, Wikipedia 0.01 sec.
(hardware)Chip Scale Packaging - (CSP) A type of surface mount integrated circuit packaging that provides pre-speed-sorted, pre-tested and pre-packaged die without requiring special testing. An example is Motorola's Micro SMT packaging.

See also: chip-on-board, flip chip, multichip module, known good die, ball grid array.

["Chip scale packaging gains at SMI. (Surface Mount International)", Bernard Levine, Electronic News (1991), Sept 4, 1995 v41 n2081 p1(2)].


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One product in the AudioEngine series is the YMU791, which features a 93-ball wafer level chip scale package (WLCSP) with dimensions of 5.
com Semiconductor memory technology company Samsung Electronics Co Ltd has developed a 1GB DDR SDRAM die-stack Chip Scale Package with improved memory density.
The machine will primarily be used for dispensing underfill material for flip chip of chip scale packages applications.
 
 
 
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