The high dielectric constant
and energy storage density of the P(VDF-TrFE)/P(VDF-TrFE-CFE) blend system can be used for practical application in flexible field-effect transistor (FET), nanogenerators and ferroelectric random access memory (FeRAM) like devices.
The dielectric response measured in terms of dielectric constant
and loss tangent depends on two parameters (ref.
The dielectric constant
of an insulating material is defined as the ratio of the charge stored in the material placed between two metallic plates to the charge stored when it is replaced by air (or vacuum).
This helps explain the interaction of material properties such as dielectric constant
and dielectric loss, and design features such as frequency and transmission line length.
This phase exhibited an ambient dielectric constant
of 242, no indication of ferroelectric behavior was observed in the temperature range 100 K to 400 K.
The object of this paper is to prepare a high thermal conductive polymer composite with a high dielectric constant
but a low dielectric loss.
These inputs are then combined with information on substrate choice of bulk silicon or ground shield, optional dielectric constant
for the packaging compound, and the electrical process specifications describing the metal, dielectric stack and substrate, to compute the models and generate the layout.
The high-performance plastic packages that have unique combination of light weight, good thermal stability, high thermal conductivity, high modulus, low coefficient of thermal expansion (CTE), and low dielectric constant
are the demand in high-density wiring or printed circuit board (PCB) used for electronics and microelectronics applications (1).
Dielectric materials for wireless communications applications must have high dielectric constant
, low loss, and temperature stability.
5% lower density than standard S-2 glass, as well as lower dielectric constant
Similar to AVX's Maxi and Maxi+ product offerings, the new single-layer ceramic capacitor series, designated Ultra Maxi, features X7R characteristics and a dielectric constant
of 60,000 - double the previous industry high for Grain Boundary Barrier Layer (GBBL) formulations.
The requirements for a dielectric material for use in embedded capacitor technology include a high dielectric constant
(especially at high frequency over MHz), a low processing temperature, a low leakage current, and a reasonably high breakdown field (11).