Hybrid Integrated Circuit

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hybrid integrated circuit

[′hī·brəd ¦int·ə‚grād·əd ′sər·kət]
A circuit in which one or more discrete components are used in combination with integrated-circuit construction.

Hybrid Integrated Circuit


a hybrid microcircuit, an integrated circuit that has microminiature components (transistors, semiconductor diodes, inductors, and so on) mounted on it, in addition to the usual elements that are permanently connected on the surface or contained within the material of the substrate. Depending on the method of fabricating the permanently connected elements, they may be classified as hybrid-film or semiconductor integrated circuits.

The resistors, capacitors, contact areas, and electrical conductors in hybrid integrated circuits are fabricated either by the successive deposition of various materials on the substrate in a vacuum (the mask deposition method and the photolithographic method) or by applying materials in the form of films (by such processes as the chemical method or the silk-screen method). The mounted components are attached to a substrate having film elements, and their leads are connected to the corresponding contact areas by soldering or welding. As a rule, hybrid integrated circuits are placed in a housing and are hermetically sealed. Their use in an electronic apparatus increases its reliability and reduces both its size and weight.


References in periodicals archive ?
Rob Baxter, Xanoptix Chairman and Chief Executive Officer, said, "This round of investment will allow Xanoptix to accelerate the deployment of our Hybrid Integrated Circuit technology, allowing customers to begin to realize the large benefits in system performance, size, cost and power dissipation.
Utilizing this Hybrid Integrated Circuit Technology to combine silicon integrated circuits and/or compound semiconductors, Xanoptix offers cost effective die integration services to component and system owners, and also designs and manufactures its own optical connection products for next generation data links and optical communication applications.
Xanoptix(TM), a developer of 3-dimensional stacked semiconductor Hybrid Integrated Circuits and a manufacturer of high-speed optical connection products, today announced the appointment of Rob Baxter to the position of Chief Executive Officer of the company.
com/research/7032e1/the_2011_import_an) has announced the addition of the "The 2011 Import and Export Market for Hybrid Integrated Circuits in China" report to their offering.
On the demand side, exporters and strategic planners focusing on hybrid integrated circuits in China face a number of questions.
This report was created for strategic planners, international marketing executives and import/export managers who are concerned with the market for hybrid integrated circuits in China.
In what follows, Chapter 2 begins by summarizing where China fits into the world market for imported and exported hybrid integrated circuits.
InterFET is a leading manufacturer and global supplier of discrete Junction Field Effect Transistors (JFETs), custom integrated circuits, hybrid integrated circuits (MCM-C) and related semiconductor devices.
Xan3D Technologies will continue to lead the industry in 3D semiconductor integration and transceiver hybrid integrated circuits.
Xanoptix(R), a technology leader in 3D semiconductor integration and transceiver hybrid integrated circuits for high-density parallel optics modules, today announced it has changed its corporate name to Xan3D Technologies(TM).
or FMI, a manufacturer of hybrid integrated circuits and thin film substrates.