known-good die

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known-good die

[‚nōn ¦gu̇d ′dī]
(electronics)
An unpackaged, fully tested integrated circuit chip.

known-good die

Chips that have been fully tested before being placed into their packages. Chips used in ceramic-based multichip modules (MCMs) are typically fully tested beforehand, because the ceramic substrates are costly to replace if the final package is faulty because of a bad chip. See MCM and known-good software.
References in periodicals archive ?
While further studies are needed to determine the applicability of a KGD in adult patients, as well as the longterm outcomes, the findings suggest it is safe and feasible, Dr.
Prior to KGD initiation, the median duration of status epilepticus was 21.
He cited one foundry/OS AT as saying, "It is not KGD unless all the pins have been tested at spec.
Fleeman concurs: "We believe the stacking of memory and resulting KGD and KGS requires full spec test," assuring KGD and KGS after thinning and after stacking.
In discussing the Fox systems, Martin Hemmerling, a sales engineer at Aehr Test, said, "People are using our WLBI and test equipment for various reasons, and certainly a big one is in the production of KGD.
In one application, KGD production is addressed by the UPstream[TM] Series of probe cards, intended for WLBI and test of memory components at up to 150[degrees]C.
Approximate Device Change 2G Tester Limitation Test Cost Impact Cost Increase >2x Increase in 8 to 12 RF Pins Dual Site Reduced 2 to 3x RF Connections Total to Single Site >2x Increase in Data Moves and Each Path Tested 2x RF Connections Host-DSP Add Test Serially Plus Time Data and DSP Handling Digital Pin- 64 to 128 Digital Adds Scan Test 2 to 3x Count in Pins in Typical Time RFSOC/SIP Configurations RFSIP Need for RF Tester at Probe Yield Loss Process KGD and Package Need Dependent High Accuracy Modulation Test Data Moves and DSP Additional Test 2x Requirements Occur in Foreground, Time Add Test Time Concurrent Test Lack of Parallel Additional Test 2x Opportunity Control Architecture Time Impact of Next-Generation Consumer Devices on 2G Tester Costs
By improving the reliability, consistency, and maintainability of probing solutions, KGD and SIP programs can better achieve the production-level goals of higher integration at lower overall costs.
Hitting every pad in the same spot each time and assuring consistent electrical characteristics from the pads to the test equipment are critical so that wafer-level testing can provide higher KGD yields with fewer false negatives.
Logic and memory combinations are increasing as KGD and logistics issues are being resolved.
At the same time, the efficiency of one-touchdown burn-in allows our customers to migrate more reliability testing to the wafer-level, an important step forward in enabling KGD.
FormFactor offers the industry's only comprehensive KGD solution and was clearly the right choice for our wafer probing requirements," said Masahide Ozawa, president, Tera Probe.