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MCP

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MCP

(1) See Microsoft certification.

(2) (MultiChip Package) A chip package that contains two or more chips. It is essentially a multichip module (MCM) that uses a laminated, printed-circuit-board-like substrate (MCM-L) rather than ceramic (MCM-C). MCPs are also tested after packaging, whereas the bare chips of ceramic-based MCMs were tested before packaging so as not to waste the more costly ceramic substrate if the chips were no good. See MCM.

Multichip Packages
These are examples of multichip packages with stacked chips (top) and side-by-side chips (bottom). The chips are wire bonded to the resin-based substrate which is attached to the printed circuit board using a ball grid array (BGA). (Illustration courtesy of Joseph Fjelstad.)

MCP - motion compensated prediction


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MCP paid Scherbart upon delivery In addition, when the fiscal year ended, MCP made value-added payments to its members.
Value-added payment receipt not deferral by Brown, Michael H. / Journal of Accountancy
MCP Tooling Technologies now offers the 5/05, a high-capacity vacuum casting machine that accelerates the production of wax patterns for investment casting.
Vacuum casting machine by Modern Casting
Toshiba has utilized advanced process and mounting technology to shrink each memory chip to 70 micron thickness, the thinnest in the world for MCP applications, and then bond the chips together in one package by wires.
Toshiba develops Multi-Chip Package (MCP) which realizes stacking of ... by EDP Weekly's IT Monitor
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