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Mallory bonding |
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Mallory bonding [′mal·ə·rē ‚bänd·iŋ]
(design engineering) Hermetically sealing polished silicon chips to polished glass plates by placing the two pieces together, heating them to about 350°C (662°F), and applying approximately 8000 volts across the assembly. Want to thank TFD for its existence? Tell a friend about us, add a link to this page, add the site to iGoogle, or visit the webmaster's page for free fun content. |
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