MicroBGA

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MicroBGA

A CSP BGA chip package from Tessera Inc., San Jose, CA (www.tessera.com). The µBGA architecture uses very fine pitch between the solder balls that enable the packaging to be barely larger than the chip itself. Tessera's unique design uses elastomer layers to withstand changes in temperature between the printed circuit board and the chip (CTE). See CSP, BGA and CTE.


µBGA Packages
Tessera's µBGA packaging allows for very small chip footprints on the printed circuit board as is obvious from this picture. (Image courtesy of Tessera Inc.)
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All types of BGA components including PBGA, CBGA, TBGA, micro BGA and EBGA can be processed and repaired.
One of the best solutions is the micro BGA because it exhibits better chip delay performance when compared to other technologies.
The system can be used by PCB and semiconductor manufacturers to conduct real-time inspection of BGA, micro BGA, flip chip, chip-on-board, bond wires and other applications needing precise measurement.
Billed as the first 9 GHz socket system for ball grid array (BGA) and micro BGA packages, this five-socket system allows the user to test, debug, or program any BGA or micro BGA, accommodating every lead pitch, ball count, grid size, and package size combination.
Its 12mmX12mm micro BGA package makes it the smallest and lightest Type-Approved baseband solution.
is a contract manufacturer offering high-speed, precision assembly of all types of printed circuit boards including surface mount technology (SMT), ball grid array (BGA), micro BGA, and flip chip.
Tessera, Micro BGA and the Tessera logo are registered trademarks of Tessera Inc.
By integrating the configuration EEPROM with the FPSLIC programmable SoC in a single 256 pin micro BGA package, Atmel has eliminated the need for any external memory, increased I/O count and reduced the required board space required by up to 70%.
As part of the expansion, Unigen has added X-ray inspection equipment and a workstation to handle testing and rework of the Micro BGA (Ball Grid Array) package for the company's RAMBUS RIMM memory modules.