MicroBGA


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MicroBGA

A CSP BGA chip package from Tessera Inc., San Jose, CA (www.tessera.com). The µBGA architecture uses very fine pitch between the solder balls that enable the packaging to be barely larger than the chip itself. Tessera's unique design uses elastomer layers to withstand changes in temperature between the printed circuit board and the chip (CTE). See CSP, BGA and CTE.


µBGA Packages
Tessera's µBGA packaging allows for very small chip footprints on the printed circuit board as is obvious from this picture. (Image courtesy of Tessera Inc.)
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References in periodicals archive ?
The Aries CSP/MicroBGA test and burn-in socket family accommodates a variety of CSP, MicroBGA, DSP, LGA, SRAM, DRAM and Flash drives by using machined (for small quantities) or custom molded (for large quantities) pressure pads and interposers.
5 mm in applications with speeds from 1 GHz to over 10 GHz, such as CSP, MicroBGA, DSP, LGA, SRAM, DRAM and Flash devices.
The system, based on the OptiCon series from GOEPEL, provides automatic recognition of shorts and solder bridges, as well as missing solder balls on ball grid array (BGA) and microBGA devices.
The ATL25/ATC25 is offered in a variety of package types including; MicroBGA, ChipScale BGA, TQFP, PQGP and other thermal enhanced packages.
Note: Tessera, MicroBGA, Compliant Chip, MicroZ and the Tessera logo are registered trademarks of Tessera, Inc.
The relationship with Feinfocus will give Palomar the ability to conduct real-time inspection of assemblies that include chip-on-board, bond wires, ball grid array (BGA), microBGA and flip chip components, as well as other applications where precise measurement is required.
Note: Tessera, Shellcase, MicroBGA, Compliant Chip, MicroZ and the Tessera logo are registered trademarks of Tessera, Inc.
8 /PRNewswire/ -- Aries Electronics, an international manufacturer of standard, programmed and custom interconnection products, today announced its new patented CSP/BallNest Hybrid Socket suitable for prototyping, test or burn-in of CSP (chip scale package), BGA (ball grid array), microBGA and LGA (land grid array) devices.
The cost-effective sockets feature replaceable interposer sets and require minimal handler tooling for use in an increased number of CSP, MicroBGA, DSP, LGA, SRAM, DRAM and Flash devices.
The system can be used by PCB and semiconductor manufacturers to conduct real-time inspection of BGA, microBGA, flip chip, chip-on-board, bond wires and other applications needing precise measurement.