In the latest ruling, the panel determined that flip-chip only packages and pin grid
array only packages are not royalty bearing but that certain other packages, principally certain wirebond and combination flip-chip-wirebond packages, are royalty bearing.
The device is available in a hermetic ceramic pin grid
There are plug-in packages like the pin grid
array (PGA), assembly materials like conductive adhesives and even metal fusion bonding, wire bonding and ultrasonic flip chip.
Mobile chips now come in two smaller packages, the Ball Grid Array, about the size of a 33 cents postage stamp, and the Pin Grid
Array, which enables the addition of components at a later stage of manufacturing for greater flexibility.
In 1,000-unit quantities, the Intel Celeron processor at 400 MHz in Plastic Pin Grid
Array (PPGA) packaging is $158, and the Single Edge Processor Package (SEPP) version is $166.
The CSL Umpire board is designed to evaluate the following patterns: 68 pin leadless chip carrier (LCC); 80 pin tiny quad flat pack (TQFP); 256 in and out (IO) ball grid array (BGA); pin grid
array (PGA) socket; 16 pin dual in-line package (DIP); and B24 comb patterns on the bottom side (16 SIR patterns in all).
The 450MHz and 500MHz mobile Intel Celeron processors are available immediately in ball grid array, pin grid
array and mobile module version, priced at USD96 and USD134 respectively in 1,000 unit quantities.
Pentium IIIs now come in two form factors: Slot One and the new flip-chip pin grid
array package, FC-PGA, which is smaller and can take advantage of existing Slot 370 motherboards.
The SP9900 monitors critical parameters in multilayer organic panels manufactured for flip chip pin grid
array (FC-PGA) and flip chip ball grid array (FC-BGA)-type packages.
The device is available today in a hermetic ceramic pin grid
While some of Intel's CPUs are still shipping in an organic land grid array (OLGA) package with solder balls, the majority of new Pentium shipments are supplied in plastic pin grid
arrays (PPGAs) as a result of demand for socketable processors.
The chip uses a Socket 370 connection and is packaged in a ceramic pin grid
array (CPGA) package.