No references found | At the IEEE 3-D IC conference held in San Francisco during the last week of September, it became clear the pace to introduce 3-D TSV technology has ramped in the past six months. The papers are presented in sections covering introductory material and applications, bonding, TSV formation and wafer thinning, three-dimensional packaging and epitaxial growth, and materials and modeling. PRUDHOE YC beat Germany's TSV DUWO 08 3-2 in their first-ever international friendly match at Prudhoe Community High School. |
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