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tape-automated bonding |
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tape-automated bonding [¦tāp ‚ȯd·ə‚mād·əd ′bän·diŋ] (electronics) A semiconductor chip (die) assembly method, where the chips are connected to polyimide (tape) carriers, complete with circuitry for attachment to a printed circuit board. The chip-bonded tape carriers typically are supplied on a reel (like a roll of film) for automated circuit assembly processes. How to thank TFD for its existence? Tell a friend about us, add a link to this page, add the site to iGoogle, or visit webmaster's page for free fun content. |
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