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tape automated bonding
(redirected from Tape-Automated Bonding)

    Also found in: Wikipedia 0.03 sec.

A process that places bare chips onto a printed circuit board (PCB) by attaching them to a polyimide film. The film is moved to the target location, and the leads are cut and soldered to the board. The bare chip is then encapsulated ("glob topped") with epoxy or plastic. See chip on board.

Tape Automated Bonding
After the chip leads are cut and soldered to the board, the chip is covered with a glob of epoxy or plastic. (Illustration courtesy of Joseph Fjelstad.)
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