Thermal Stress

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thermal stress

[′thər·məl ′stres]
Mechanical stress induced in a body when some or all of its parts are not free to expand or contract in response to changes in temperature.

Thermal stress

A stress produced by thermal movement that is resisted by the building; if the thermal stresses are higher than the capacity of the materials to resist them, expansion or contraction joints are required.

Thermal Stress


(Russian, temperaturnoe napriazhenie), a stress produced in a body as a result of a nonuniform distribution of temperature in different parts of the body and some restriction on the possibility of thermal expansion or contraction imposed by adjacent parts of the body or by other bodies surrounding the body in question. An example of thermal stresses is the tensile stresses produced in a wire stretched between fixed supports as the wire is cooled. Thermal stresses can cause the failure of machine components, buildings, and structural members. Expansion joints and other means, including gaps between successive lengths of rails, gaps between the blocks of a dam, and rollers on bridge supports, are used to prevent such failures.

thermal stress, temperature stress

Stress introduced by uniform or nonuniform temperature change in a structure or material which is constrained against expansion or contraction.
References in periodicals archive ?
l] effect on the local area, including the overall structure of the film caused by the discontinuous stress, Workbench stress linearization results did not distinguish between primary stress and secondary stress of two, with the following treatments: 1, due to thermal stress is two times of stress, not including the film stress at room temperature should be regarded as a film stress of two thermal stress, a thin film this treatment of stress will include two stress components, but considering the convenience and safety of the components in the two angle still stress a range of stress.
Isayev, Thermal Stress in Concise Encyclopedia of Polymer Science and Engineering, J.
High aluminum lining can effectively reduce the thermal stress of bottom lining from the above stress analysis.
The thermal stress characteristics of the novel helix SWS is simulated by software ANSYS.
Thermal and mechanical fields are coupled with each other in 3D ICs: thermal stress is caused by the temperature variation and the mechanical properties of materials are temperature dependent; thermal stress can cause deformation to the structure, which affects the temperature distribution.
In the presence of an edge crack, the degree of damage severity caused by thermal loads was generally measured by determining the thermal stress intensity factor (TSIF) at the crack tip.
But, the thermal stress values can be higher than the mechanical ones, and can lead to cracks on the surface and in the surface layer of the parts, specific to the thermal fatigue cracking phenomenon.
In thinner cells, however, the individual cells are more susceptible to the thermal stress generated when connected to photovoltaic wires, which sometimes results in warp.
However, in thinner cells, the individual cells are more susceptible to the thermal stress generated when connected to photovoltaic wires, which sometimes result in warp.
The fully perforated side-vented coater drum and cabinet design allows for highly effective drying without the high drying temperatures that can put thermal stress on the product.