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[′vē·ə or ′vī·ə]
A pathway that is etched to allow electrical contact between different layers of a semiconductor device.


(1) By means of, by way of. From Latin for "way" or "path."

(2) (Virtual Interface Architecture) See VI.

(3) (Vertical Interconnect Access) In a printed circuit board, a conducting pathway between two or more substrates (layers). The via is created by drilling through the board at the appropriate place where two or more layers will interconnect and allowing copper to run through the hole. The copper may coat only the sides of the hole or fill the entire hole. See printed circuit board.

(4) (Vertical Interconnect Access) In a chip, a conducting pathway between two or more layers. In a 3D chip, two or more stacked dice are connected via "through-silicon vias" (TSVs) which are pathways that pass completely through the die.

Creating Vias
In the antifuse programmable chip technology, a circuit is closed by turning non-conductive silicon into a conductive via. See antifuse.
References in periodicals archive ?
A via typically has a drill diameter and a copper conducting thickness formed during a plating process.
In this way, the via-fill material can be forced into the vias under a controlled and consistent pressure; the results are better via-filling after fewer passes, and a faster excursion time.
This is a simple example, and most board shops have their own methods for blind and buried via structures.
This allows capturing the interaction between the vias and each other, the board planes, any nearby stitching vias, as well as the traces connected to the vias.
This has a minimal impact on impedance, but will help reduce crosstalk between signal vias.
If stitching vias are not used to localize the common mode, simulation of the whole board in a 3D full-wave solver with all plane terminations may be required.
On Layer 3, the entire outside perimeter of the BGA is wide open, with only the vias for power and ground appearing.
In FIGURE 1, the 1:2 microvias are aligned in columns to maximize route density (12% improvement over shifted blind vias, 36% improvement over quadrant dog-bone through vias.
At lower frequencies, these ground-return vias are not critical, and normal ground-to-ground stitching can be used to provide a suitable return path.
MiVia technology eliminates the need for drilling vias, and therefore allows for higher density and via-in-pad layouts.
In addition, passive components can be placed directly over the vias on the bottom side of the BGA, reducing inductance, rather than outside the perimeter of the BGA (FIGURE 3).
Hundreds of thousands of Micro-filled Vias have exhibited zero failures in six standard temperature and electrical stress tests spanning thousands of cycles over thousands of hours.