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via

[′vē·ə or ′vī·ə]
(electronics)
A pathway that is etched to allow electrical contact between different layers of a semiconductor device.

via

(1) By means of, by way of. From Latin for "way" or "path."

(2) (Virtual Interface Architecture) See VI.

(3) (Vertical Interconnect Access) In a printed circuit board, a conducting pathway between two or more substrates (layers). The via is created by drilling through the board at the appropriate place where two or more layers will interconnect and allowing copper to run through the hole. The copper may coat only the sides of the hole or fill the entire hole. See printed circuit board.

(4) (Vertical Interconnect Access) In a chip, a conducting pathway between two or more layers. In a 3D chip, two or more stacked dice are connected via "through-silicon vias" (TSVs) which are pathways that pass completely through the die.


Creating Vias
In the antifuse programmable chip technology, a circuit is closed by turning non-conductive silicon into a conductive via. See antifuse.
References in periodicals archive ?
But through the years there has been very little written about the current carrying capacity of a via.
Conventional benchtop methods of filling vias are heavily reliant upon manual processes; typically, a human operator uses a squeegee to force material into the vias through a stencil.
Removing the blind vias connecting layers 1 to 2 and 7 to 8, however, would reduce this to two lamination cycles.
If there are insufficient stitching vias (or bypass capacitors) to provide a return path, or if multiple signal vias share the same return path, a great deal of via-to-via crosstalk can occur.
We are excited to be working with an innovative company like VIA on their new dynamic physical power flow," stated Andrew Yang, CEO of Apache.
For vias to be transparent, the first step is to minimize the stub length, then worry about designing a 50[ohm] via.
When using via patterns to increase route density, the vias for the differential pairs sometimes are spread apart.
MiVia technology eliminates the need for drilling vias, and therefore allows for higher density and via-in-pad layouts.
2+N+2 = Type III (Layer 1:2, 2 to 3 microvias with buried vias in a laminated core)
FIGURE 2 shows how shifting the vias can add an additional 24% increase in the number of escape traces at the edge of the BGA.