wafer scale integration

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wafer scale integration

The evolution in semiconductor technology that builds a gigantic circuit on an entire wafer. Just as the integrated circuit eliminated cutting apart thousands of transistors from the wafer only to wire them back again on circuit boards, wafer scale integration eliminates cutting apart the chips. All the circuits for an entire computer are designed onto one super-sized chip.

Thus far, wafer scale integration has not come to fruition (see Trilogy); however, chip packaging such as the multichip module (MCM) and multichip package (MCP), in which several chips are connected closely together in a single housing, has become widely used.
References in periodicals archive ?
Among the topics are low-temperature bonding for optical microsystems applications, three-dimensional wafer-scale integration for radio frequency and digital applications, thick bonded silicon-on-insulator wafers with poly-silicon interlayer for gettering metal impurities, and an oxide-free silicon-to-silicon carbide hetero-bond.
The objective of this program with DARPA is to develop electronic components for wafer-scale integration of phased-array antenna systems, focusing on distribution of radio frequency (RF) and control signals.
This technology allows us to quickly ramp from several millions to several tens of millions of components per month and enables our customers to benefit from wafer-scale integration of optics with semiconductors," says Chuck Milligan, Heptagon's CEO.
The objective of this program with the DARPA is to validate and develop an approach to wafer-scale integration of phased-array antenna electronics, focusing on wafer-scale interconnects for radio frequency (RF) and control signals.
Achieving a paradigm shift in the design and manufacture of MEMS sensors, InvenSense uses its patented Nasiri-Fabrication process for wafer-scale integration that leapfrogs the cost issues faced by other MEMS sensor makers.
We believe the terra-Q 25G-5 is further evidence that Cierra continues to lead the industry in wafer-scale integration of fiber optic components.
InvenSense is leveraging its proprietary MEMS design and fabrication technology, protected by more than 12 patents, to produce a whole new generation of MEMS-based products utilizing cost effective wafer-scale integration and packaging.