Among the topics are low-temperature bonding for optical microsystems applications, three-dimensional wafer-scale integration
for radio frequency and digital applications, thick bonded silicon-on-insulator wafers with poly-silicon interlayer for gettering metal impurities, and an oxide-free silicon-to-silicon carbide hetero-bond.
The objective of this program with DARPA is to develop electronic components for wafer-scale integration
of phased-array antenna systems, focusing on distribution of radio frequency (RF) and control signals.
Producers are quickly moving toward wafer-scale integration
and increasing use of flip chip, ball grid array and chip scale packaging technologies.
This technology allows us to quickly ramp from several millions to several tens of millions of components per month and enables our customers to benefit from wafer-scale integration
of optics with semiconductors," says Chuck Milligan, Heptagon's CEO.
The objective of this program with the DARPA is to validate and develop an approach to wafer-scale integration
of phased-array antenna electronics, focusing on wafer-scale interconnects for radio frequency (RF) and control signals.
Achieving a paradigm shift in the design and manufacture of MEMS sensors, InvenSense uses its patented Nasiri-Fabrication process for wafer-scale integration
that leapfrogs the cost issues faced by other MEMS sensor makers.
We believe the terra-Q 25G-5 is further evidence that Cierra continues to lead the industry in wafer-scale integration
of fiber optic components.
InvenSense is leveraging its proprietary MEMS design and fabrication technology, protected by more than 12 patents, to produce a whole new generation of MEMS-based products utilizing cost effective wafer-scale integration