The application of numerical simulations (MoldFlow) and the integration of experimental and statistical techniques were used to determine the optimal parameter selection and the most significant parameters that affected the warpage
JESD22-B112, High Temperature Package Warpage
Measurement Methodology, is the most closely related standard on the list.
In first step, the effects of the injection parameters on warpage
for different thickness values were examined using Taguchi method.
is primarily caused by residual stresses generated during the injection cycle.
However, this molding technique has one main drawback, in that the molded parts are prone to warpage
as a result of an asymmetric cooling process (9-11).
But as the path gets closer to the center of the board, where the worst warpage
is experienced, we decrease the z-height by as much as 1.
Plastic was an obvious option, but reducing part warpage
was a critical challenge, since a flat base plate is necessary in order for the power tool to function properly.
was measured before and after annealing by scanning the specimens with a scanner (Hewlett-Packard, USA).
It examines computer-aided methods of forecasting shrinkage and warpage
, and provides representative data to work with.
Other benefits include reduced warpage
after the part has been removed from the mold and better material flow in thin-wall sections of a part.
Keywords in this release: back-end semiconductor manufacturing technologies, European Union, Restriction of Hazardous Substances (RoHS), tin-silver-copper - Sn-Ag-Cu, SAC system, gold, copper, high yield loss, flip-chip, FC, PbSn, lead-tin, board assembly, underfill, substrate warpage
, thermal mismatch, reflow, eutectic tin lead solder, flip chip/chip scale package, FC/CSP
These initiatives will focus on warpage
(understanding the causes of, and establishing methods for measuring), wiring density and holistic modeling.