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wire bonding |
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wire bonding [′wīr ‚bänd·iŋ] (electricity) Lead-covered tie used to connect two cable sheaths until a splice is permanently closed and covered. (electronics) A method of connecting integrated-circuit chips to their substrate, using ultrasonic energy to weld very fine wires mechanically from metallized terminal pads along the periphery of the chip to corresponding bonding pads on the substrate. The attachment of very fine aluminum or gold wire (by thermal compression or ultrasonic welding) from metallized terminal pads along the periphery of an integrated circuit chip to corresponding bonding pads on the surface of the package leads. How to thank TFD for its existence? Tell a friend about us, add a link to this page, add the site to iGoogle, or visit webmaster's page for free fun content. |
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Typical uses for the 8000 will be wire bonding for microelectronic packaging including most semiconductor-based interconnect applications. is the leading developer and licensor of insulated wire bonding technologies for use in the design and assembly of microelectronic devices. Microbonds is working closely with alliance partners on specific technical programs aimed at ensuring immediate compatibility with adjacent processes such as: wire bonding equipment, capillaries, plasma cleaning and transfer molding. |
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