In a conventional molded
J-lead package, the anode wire is welded to one side of the
J-lead, and the cathode side is glued to a lead frame pocket with a conductive epoxy.
Or I could bend the leads under to approximate a
J-lead part.
The
J-lead and gullwing configurations are superior to the standard through-hole.
X-ray inspection of a lifted
J-lead (Figure 1) was part of an investigation to pinpoint the possible cause of open joints.
Due to the non-wetting (no-flow) characteristic of lead-free solder,
J-Lead and Gull Wing component leads are not recommended.
This product offers numerous advantages over alternative technologies, including two surface-mount packaging options (ball-grid and
J-lead), an orientation independent footprint, small physical outline, excellent temperature stability (< 2 ppm/[degrees]C), low insertion loss (< 0.3 dB/ns), and less than 0.5[degrees] p-p phase ripple.
Additionally,
J-lead packaging technology is used to reduce footprint to .39-inch x .50-inch (9.8mm x 12.6mm), requiring minimal board space.
Currently, the PVG3 series offers two terminal shapes:
J-lead (PVG3A) and Gull Wing (PVG3G).
In a conventional molded,
J-lead package (FIGURE 4), the anode riser wire is welded to one side of the
J-lead, while the tantalum element, which features an external cathode coating, is affixed to a lead frame pocket with conductive epoxy.