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ruggedization

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ruggedization

[‚rəg·ə·də′zā·shən]
(electronics)
Making electronic equipment and components resistant to severe shock, temperature changes, high humidity, or other detrimental environmental influences.
McGraw-Hill Dictionary of Scientific & Technical Terms, 6E, Copyright © 2003 by The McGraw-Hill Companies, Inc.
References in periodicals archive
"In addition to enhancing our product line-up, we plan to accelerate new product development by integrating STI's patented optical applications, expertise in device ruggedization, and value-added services with OMRON's own innovative automation, sensing and control technologies," said Yoshinori Matsueda, the newly appointed CEO of OSTI.
They're built by the zillions for laptops and they have a little bit of ruggedization for our application so they just don't break.
Even many dual-use COTS information and communications technologies are not easily (or cheaply) adapted to military use, as they often require substantial modification, such as ruggedization or additional capabilities.
Finite element analysis (FEA) is a modeling/simulation alternative, or more accurately, accompaniment to the tests, and is used to show current reliability or to improve ruggedization of a part.
The ruggedization of COTS items, at the component or the device/unit level, allows for increased reliability, i.e., an increased MTBE Cost and labor benefit from less frequent downtime for repair.
TABLE I VN SERIES DATA Electrical Data Max frequency 67 GHz Impedance 50 [OMEGA] nominal Velocity of propagation 69 % nominal Time delay 1.47 Ns/ft (4.82 Ns/m) Capacitance 29.0 pF/ft (95.1 pF/m) Mechanical Data Jacketed outer diameter 0.625" (15.9 mm) Outer jacket type PET braid Ruggedization metal braid over metal armor Minimum bend radius 1.5" (38.1 mm) Operating temperature -76[degrees] to 347[degrees]F (-60[degrees] to 175[degrees]C) Weight 0.175 lbs/ft (0.26 kg/m) Inner conductor solid Ag-placed Cu Dielectric PTFE Outer conductor Cu GrooveTube[R] TABLE II VN SERIES TYPICAL INSERTION LOSS (dB) Frequency Band Part Attenuation Connector SWR (GHz) No.
These efforts led to successful product introduction from multichip module assembly platform, low-cost bumping, low-cost laminates design and fabrication, package ruggedization, package thermal enhancement, and CAD-based tools for package design, analysis, and optimization, and reactive flow modeling.
CRI's ruggedization includes shock mount, rackmount, and high- or low-temperature modifications of SGI compute, visualization and storage systems used by the military to acquire, process, fuse and visualize mission-critical data.
There are three general levels of ruggedization: semi-rugged, fully rugged, and ultra rugged.
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