package on package
A chip package that contains two ball grid array (BGA) chips. A package on package (PoP) typically includes a RAM chip on top and a CPU chip on the bottom. See BGA and chip package. |
| A 3D Package |
|---|
| The top BGA package typically contains RAM, which can also be a multi-die module itself, while the bottom BGA holds the logic chip (the processor). The light green elements are the BGA substrates. The PCB is the printed circuit board. |
Copyright © 1981-2025 by The Computer Language Company Inc. All Rights reserved. THIS DEFINITION IS FOR PERSONAL USE ONLY. All other reproduction is strictly prohibited without permission from the publisher.