Another component of the acid copper addition agent system will be high molecular weight polyether compounds, surfactants, polyoxyalkylene glycols, and others of similar structure.
Typically, the addition agent package consists of grain refiners, leveling agents and suppressors.
Typically, when that assumption is made, the reaction is to add more organic addition agent to the plating solution, but that will cause additional harm to the functioning of the plating solution.
If the film is not forming properly, one may expect to see these types of nodules, as well as issues related to excessive consumption of the organic addition agents (brighteners, etc.
These include too low an operating temperature, imbalance of key addition agents
or a combination of too high a concentration of the metal salt in solution in combination with the acid level.
In addition agents
will be able to obtain licensing forms, order paramedical exams, and take continuing education courses on-line.
It is well understood that the organic addition agents
utilized in acid copper plating processes influence the physical properties of the deposit and provide improved characteristics.
Additives are chemical addition agents
which are mixed in tiny quantities with coatings, inks and plastics and which serve to refine and finish paper surfaces.
They become in addition agents
for a corporate enterprise which regards patients as customers.