anneal

(redirected from anneals)
Also found in: Dictionary, Thesaurus, Medical.
Related to anneals: Harold Urey

anneal

[ə′nēl]
(engineering)
To treat a metal, alloy, or glass with heat and then cool to remove internal stresses and to make the material less brittle. Also known as temper.
(genetics)
To recombine strands of complementary deoxyribonucleic acid that were separated by heating or other means of denaturation.

anneal

To take the brittleness out of metal, plastic or certain carbon composites. Performed in the preparation of new products or in their restoration, annealing is accomplished via a heat treating process.
References in periodicals archive ?
That is, primers 3 and 4 anneal to and ligate across the (1+2) product, and primers 1 and 2 anneal to and ligate across the (3+4) product.
If a power failure occurs while the furnace is near its upper temperature limit of 2,500F and the outage continues, $100,000 worth of heating elements inside the furnace could be lost, as well as any parts under-going the anneal.
This amplification efficiency approaches that of PCR, and with similar specificity as defined by the need for two primers to anneal to matching target sequences.
Applied's millisecond anneal technology will enable us to successfully fabricate our customers' most advanced device designs," said Dr.
We are delighted to partner with Aviza to provide furnaceware for slip free, high temperature anneal processes," said Tom Cadwell, president and CEO of Integrated Materials.
This gives both logic and memory device makers the ability to cover the full array of advanced thermal processing applications in transistor formation, including anneals for ultra shallow junctions, dry oxidation, silicides, shallow trench isolation (STI) oxides, and boron-doped phosphosilicate glass (BPSG) and titanium nitride (TiN) densification.
We believe this new fully-automated vertical laminar flow polyimide bake solution will provide the best process for the curing of both polyimide or BCB, as well as copper anneal.
This feed-forward control approach provides superior spike anneal performance relative to the lamp RTP feedback systems based on conventional proportional derivative "PID" control.
The STEAMpulse is a breakthrough RTP system for applications such as high-temperature thin and thick oxides, post-dielectric deposition anneals, selective oxidation and low-temperature copper anneals.
The system provides a full suite of leading-edge applications, which includes silicides, TiSi2 or CoSi2; implant anneals, ultra-shallow junctions without "spike anneals"; high k dielectric anneals (Ta2O5, BST, SBT); glass reflow and/or densification (BPSG, PSG); curing of low k films; and low-temperature copper anneal.
The formation of ultra-shallow junctions, for example, requires precise, rapid (spike) implant anneals that limit high temperature exposure of the wafer to a few seconds.