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area array package |
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area array packageA chip package in which any part of the surface area of the chip can be used for interconnection, rather than just the outer perimeter. See pad limited, flip chip, BGA and CSP. How to thank TFD for its existence? Tell a friend about us, add a link to this page, add the site to iGoogle, or visit webmaster's page for free fun content. |
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BGA: Ball Grid Array, an area array package utilizing solder balls |
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