area array package


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area array package

A chip package in which any part of the surface area of the chip can be used for interconnection, rather than just the outer perimeter. See pad limited, flip chip, BGA and CSP.
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Technology Collaboration Aims to Strengthen Innovation within Area Array Package Portfolio
HERE IS A close-up optical image of a small area array package placed on a solder paste deposit.
BGA: Ball Grid Array, an area array package utilizing solder balls
CS2's products cover the entire Area Array Package spectrum including, PBGA, L/FBGA, CSP and HDP utilizing a wide range of materials such as BT resin and other high TG laminates, ceramic, and flex based substrates.
High-temperature component warpage is a concern known to affect the robust assembly performance of area array package types.
Conformal Coat Impact on Area Array Package Solder Joint Reliability"
The six-heat cycle requirement reflects the maximum heat cycle an area array package can be expected to be exposed to, including: two reflows, wave soldering, component removal, reballing and reattachment).
Moire interferometry, performed by StorageTek, was used to determine the coefficient of thermal expansion (CTE) of each area array package.
If the estimates are correct regarding the expected use of such components, area array package repair must become a viable, user-friendly and cost effective option for millions of repair operators worldwide.
However, FC technology has lagged its fellow area array packages because of component, material and process obstacles.
16 /PRNewswire/ -- FlipChip International (FCI) today announced that it has signed a patent license agreement with Cookson Electronics covering its intention to facilitate the industry's ease in adopting the use of Polymer Collar(TM) technology to enhance the drop-shock and thermal cycling reliability of area array packages, particularly wafer level packages used for hand-held devices.
For example, x-ray inspection permits examination of the solder joint quality of area array packages such as BGAs and CSPs.

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