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ball bonding

   Also found in: Wikipedia 0.01 sec.
ball bonding [′bȯl ‚bänd·iŋ]
(engineering)
The making of electrical connections in which a flame is used to cut a wire, the molten end of which solidifies as a ball, which is pressed against the bonding pad on an integrated circuit.


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Wedge bonding can achieve finer pad pitch geometries than ball bonding with the same wire diameter because of the smaller amount of bond "squash" or wire deformation.
The consumer market demand for smaller and more complex electronic devices is driving the wire bonding industry to set new ball bonding limits.
Processes include high accuracy component assembly with eutectic solder or epoxy, precision ball bonding, and wedge bonding for fine pitch devices, as well as epoxy, laser weld and solder based attachment of actively aligned photonic devices.
 
 
 
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