ball bonding


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ball bonding

[′bȯl ‚bänd·iŋ]
(engineering)
The making of electrical connections in which a flame is used to cut a wire, the molten end of which solidifies as a ball, which is pressed against the bonding pad on an integrated circuit.
References in periodicals archive ?
Characterization and Modeling of Fine-Pitch Copper Ball Bonding on a Cu/Low-k Chip"
Wedge bonding can achieve finer pad pitch geometries than ball bonding with the same wire diameter because of the smaller amount of bond "squash" or wire deformation.
The consumer market demand for smaller and more complex electronic devices is driving the wire bonding industry to set new ball bonding limits.
Processes include high accuracy component assembly with eutectic solder or epoxy, precision ball bonding, and wedge bonding for fine pitch devices, as well as epoxy, laser weld and solder based attachment of actively aligned photonic devices.
In recent years, K&S has expanded its product offerings through strategic acquisitions, adding wedge bonding and a broader range of expendable tools to its core ball bonding products.
Quik-Pak offers copper ball bonding using wires with diameters ranging from 20um (0.
Gold is the most widely used metal for IC wire bonding because of its resistance to surface corrosion and high productivity through the gold ball bonding process.
In recent years, K&S has expanded its product offerings through strategic acquisitions, adding die and wedge bonders and a broader range of expendable tools to its core ball bonding products.
Custom Assembly services include Die Bonding, Gold Wire Ball Bonding, Encapsulation & Remolding and Marking.
Traditional eutectic ball bonding is unsuitable because of temperature constraints on the fully fabricated MSA devices.
Nam Tai" or the "Company") (NYSE Symbol: NTE; CBOE Symbol: QNA; Frankfurt Stock Exchange Symbol: 884852) announced that it has successfully upgraded its Chip On Board ("COB") production technology to include gold wire ball bonding for manufacturing CMOS image sensor modules in mega pixel level quality.
The company has also upgraded its chip-on-board technology to include gold wire ball bonding for manufacturing CMOS image sensor modules at megapixel quality.