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bare die |
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See bare chip. |
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The DiePak carrier is a reusable, temporary package that enables IC manufacturers to perform cost-effective final test and burn-in of bare die. The MobileStak designs can integrate a variety of chip packages, as well as devices provided as bare die. ChipX offers an extensive array of packaging options for portable consumer devices, including diminutive wafer scale packaging ("die bumping"), bare die, small footprint TFBGA and QFN packages. |
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