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bare die

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See bare chip.
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The DiePak carrier is a reusable, temporary package that enables IC manufacturers to perform cost-effective final test and burn-in of bare die.
Aehr Test Systems Schedules Second Quarter Fiscal Year 2007 Earnings ... by Business Wire
The MobileStak designs can integrate a variety of chip packages, as well as devices provided as bare die.
Staktek Announces Stacking Solution for Mobile Processors and ... by Business Wire
ChipX offers an extensive array of packaging options for portable consumer devices, including diminutive wafer scale packaging ("die bumping"), bare die, small footprint TFBGA and QFN packages.
ChipX Joins CE-ATA Workgroup to Develop Portable Storage Solutions by Business Wire
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