beam lead

beam lead

[′bēm ‚lēd]
(electronics)
A flat thick-film lead, sometimes of gold, deposited on a semiconductor chip chemically or by evaporation, as a connecting lead for a semiconductor device or integrated circuit.
References in periodicals archive ?
Designs utilize high performance GaAs Schottky Barrier Beam Lead Diodes in balanced configurations that require a +13 dBm LO drive and display low levels of conversion loss.
The detector circuitry uses high performance GaAs Schottky Barrier Beam lead diodes with very low junction capacitance.
The detector circuitry utilizes high performance GaAs Schottky Barrier Beam lead diodes with very low junction capacitance.
Micro ball grid array is a type of chip scale packaging that uses beam lead bonding instead of traditional wire bonding; this reduces the surface area to at least 25% smaller than standard TSOP packing.
Pasternack Unveils New Zero Biased Waveguide Detectors Utilizing GaAs Schottky Barrier Beam Lead Diodes
The detector circuits use high performance GaAs Schottky Barrier Beam lead diodes with extremely low junction capacitance.
This selection of waveguide detectors utilize high performance GaAs Schottky Barrier Beam lead diodes that exhibit high sensitivity performance in Ka, Q, U, V, E and W bands without external DC bias or mechanical tuning," explains Tim Galla, Active Components Product Manager at Pasternack.
28, 1998--M/A-COM, a division of AMP Incorporated and the leading global provider of wireless radio frequency (RF), microwave and millimeter wave components, today announced a new family of GaAs Beam Lead Schottky Barrier Diodes.
This new family of GaAs Beam Lead Diodes was designed to replace the MA40415, MA40416 and MA40422 diodes.
Unlike plastic packages, which require wire bonding, micro BGA uses beam lead bonding.
These include epoxy conductive die bonding with a placement accuracy of 20 microns, glue thickness between 3 and 10 microns and a minimum usable component size of 250 microns, fluxless soldering of the MMIC and substrate, plasma cleaning, wire bonding (Au ball and wedge bonding) with a diameter of 17/20/25 micron Au wire, ribbon bonding, parallel gap welding of Au ribbon and beam leads, and hermetic sealing by laser welding in a humidity free environment.