Integration von i2Gi(TM) in 8000 Ball Bonder
(Integrating i2Gi(TM) onto an 8000 Wire Bonder
Court papers lodged in Los Angeles Superior Court yesterday describe Bing's alleged affair with Bonder
10% higher UPH (Units Per Hour) over the first generation ConnX ball bonder
A typical high-speed ball bonder
will offer only a 4 sq.
The message: Choose a bonder
that can run both alloy and epoxy attachment processes so that the bonder
's use can be maximized.
representative for Meiki injection presses and Origin uv lacquer bonders
), introduced The UV Flashlight DVD Bonder
The CB8 semi-automated 200mm wafer bonder
recently installed at MST.
Click here to read the launch press release for the 8000i Wire Bonder
said Wilfried Bair, VP Business Development and General Manager, Bonder
Division, "It shows our customers that we are producing leading-edge and top quality wafer processing equipment covering all steps from design and development, to manufacturing, installation and after-sales support.
July 18, 2013 /PRNewswire-iReach/ -- Palomar Technologies, the world-leading provider of precision microelectronics and optoelectronic packaging systems, today announced the launch of new products at SEMICON West 2013: the 8000i Wire Bonder
with Intelligent Interactive Graphical InterfaceTM( i2GiTM) and VisionPilotTM for automated high-precision die attach.
In addition, the paper, Chain Wire Bonding of a RF-SOE Package Using a Gold Ball Bonder
, will be presented on July 14, 2008 at the IMAPS/SEMI Advanced Technology Workshop by Palomar Technologies senior scientist Dan Evans and systems engineer Albert Perez.
The 3800 Die Bonder
demonstration will reveal a fully automated component attach program highlighting the flexibility & high precision of the sub-5[eth]-m placement accuracy die attach system