bonding pad

bonding pad

[′bän·diŋ ‚pad]
(electronics)
A metallized area on the surface of a semiconductor device, to which connections can be made.
References in periodicals archive ?
The connections between chips and circuit boards traditionally are made from pre-fabricated metal wires that connect to a designated bonding pad on a chip.
Once cooled the probe is subjected to a pull test which applies a test load that is symmetrical to the solder ball attach to the bonding pad.
suppliers by offering a bonding pad pitch of 81 microns on center in the
K&S is the only equipment supplier that also develops and manufactures the products that touch a semiconductor chip's wire bonding pad surfaces, starting with electrical testing and ending with specially formed wire interconnections that remain as a part of the chip's package.
K&S is the only equipment supplier that also develops and manufactures all the products that touch a semiconductor chip's wire bonding pad surfaces, starting with electrical testing and ending with specially formed wire interconnections that remain as a part of the chip's package.
For example, we were able to jointly establish optimally compatible chip bonding pad and package ball array configurations.
As a result of several years of investment in research and development, the company has developed a patented silicon-on-silicon chip stacking technology based on the ability to reposition the bonding pad terminals on an integrated circuit and electrically wire a stack of integrated circuits together vertically.
Up to four metal layers are used for interconnects while the fifth layer provides a bonding pad array for high pin count flip chip designs.
Inside insulation: lining the walls by glue bonding pads of insulating composite panels made of plasterboard bonded to an insulating panel; lining walls by bulkhead against consists of a plaster plate metal frame and insulating rigid or semi-rigid plate; lining of walls against-partition Plasterers bricks; diverse,
The system ordered encompasses an ultrasonic bonding head and a high force bonding head equipped with a confinement chamber that reduces oxide on bumps and bonding pads.
One idea is to craft a wafer into an array of caps, add an interface for connecting to chip pads and then form feed-through conduits that terminate to bonding pads that can be bumped (Figure 1).
WLCSP eliminates the area overhead of conventional BGA packaging and it is done with a standard die by fabricating an additional metal redistribution layer to re-route the I/O lines from the perimeter bonding pads to an array.