bonding pad

bonding pad

[′bän·diŋ ‚pad]
(electronics)
A metallized area on the surface of a semiconductor device, to which connections can be made.
References in periodicals archive ?
The connections between chips and circuit boards traditionally are made from pre-fabricated metal wires that connect to a designated bonding pad on a chip.
Once cooled the probe is subjected to a pull test which applies a test load that is symmetrical to the solder ball attach to the bonding pad.
The combination of the T-section, wire bond and bonding pad on the MMIC establishes a predetermined characteristic impedance (50 [omega]) over a certain frequency range.
The width of the final deformed bond can be the same size as the bonding pad, if not larger.
The geometry uses a multifeed T gate layout with the two small side gate pads connected to the central gate bonding pad by an air bridge.
K&S is the only equipment supplier that also develops and manufactures the products that touch a semiconductor chip's wire bonding pad surfaces, starting with electrical testing and ending with specially formed wire interconnections that remain as a part of the chip's package.
K&S is the only equipment supplier that also develops and manufactures all the products that touch a semiconductor chip's wire bonding pad surfaces, starting with electrical testing and ending with specially formed wire interconnections that remain as a part of the chip's package.
For example, we were able to jointly establish optimally compatible chip bonding pad and package ball array configurations.
As a result of several years of investment in research and development, the company has developed a patented silicon-on-silicon chip stacking technology based on the ability to reposition the bonding pad terminals on an integrated circuit and electrically wire a stack of integrated circuits together vertically.
Up to four metal layers are used for interconnects while the fifth layer provides a bonding pad array for high pin count flip chip designs.
This electrode extends over all 30 cells and connects to the bonding pads (not shown in the image) via the surface conductors at one side for the first phase and on the other side for the second phase.