bump contact

bump contact

[′bəmp ‚kän‚takt]
(electronics)
A large-area contact used for alloying directly to the substrate of a transistor for mounting or interconnecting purposes.
References in periodicals archive ?
For further information on Bounce 'n' Bump contact 01484 222087 or e-mail roz.
Because of the relatively high I/O required to interface multiple die, the interposers commonly adopt a uniform array configured ball or bump contact design.
Ground-bounce and cross-talk are minimized by a die design that provides two (CSPRC030 and CSPRC032) or eight (WLP200) solder bump contacts to the common supply connection.
In compliance with the Restriction of Hazardous Substances (RoHS) directive, both devices, including the bump contacts used to connect the chips to the boards, are completely lead-free.