Then she took a big breath and bumped
Founded by Kiran Patel, a frequent commuter, Bumped
Such statements include, without limitation, statements regarding the expected growth in the bumped
wafer market, the anticipated performance of the WI-3000 and its potential influence on the further shrinking of wafer bumps.
August Technology's NSX Series and 3Di Series inspection systems, in combination with the YieldPilot data analysis software, provide bumped
device manufacturers with critical process enhancing information through high-speed, automated, two-dimensional (2D) and three-dimensional (3D) inspection and powerful data analysis.
wafers are utilized in flip-chip packaging technologies to produce smaller, faster, and more complex integrated circuits.
Traditionally IC Interconnect has only bumped
wafers, often routing customers to other subcontractors for additional operations.
The 3Di Series of inspection equipment from August Technology can be configured for 150mm - 300mm bumped
wafers and can be operated in a 2D only, 3D only, or 2D/3D inspection modes for optimum efficiency on the bumping floor.
In the initial phase of volume production, ASE is setting a monthly capacity of 10,000 pieces of 200mm electroplated bumped
According to Dataquest, the number of bumped
wafers is expected to grow by 288% over the next four years.