I'm proud of our team for achieving world-class manufacturing capabilities in bumping
process technology within such a short period of time, and recognized by Qualcomm Technologies.
Availability of keys plays a critical role in whether bumping
can be successful.
All this bumping
to pass can be attributed to improvements in racing.
Note that solder bumping
takes place at the wafer level and not the single die level.
Because the NSX is a complete solution, performing accurate and consistent high-speed bump inspection on many different bump applications, the NSX Series is an excellent solution for Flip Chip Technologies and the licensees of their bumping
technology," Nelson continued.
Average bump height measurements and standard deviations for each die on a single wafer can be plotted as a surface showing characteristic bumping
process variation across a wafer.
So, as her family waved good-bye, Bumpelina left to go bumping
facility's floor space will be increased by 100 percent and the increased capacity will be three times that of UAT's current bumping
Our Sigma fxP PVD system provides Chipmore with the most cost effective means to expand their bumping
capacity to meet the demand from display-driver IC manufacturers.
There is no need for expensive evaporation equipment or mask aligners as required for many solder bumping
techniques, and the bumps are formed in one step as opposed to deposition of several layers of metal.
TSMC s leading-edge flip chip BGA package technology provides Arria 10 devices with better quality and reliability than standard copper bumping
solutions through the use of fine-pitch copper bumps.
IC Interconnect (ICI), a wafer bumping
service company, announces an agreement with Jiangyin Changdian Advanced Packaging (JCAP), a company specializing in solder bump, gold bump and pillar bump mass production.