bumping


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bumping

[′bəm·piŋ]
(aerospace engineering)
(chemistry)
Uneven boiling of a liquid caused by irregular rapid escape of large bubbles of highly volatile components as the liquid mixture is heated.
(mechanical engineering)
(metallurgy)
Forming a dish in metal by many repeated blows.
References in periodicals archive ?
So, as her family waved good-bye, Bumpelina left to go bumping.
The bumping facility's floor space will be increased by 100 percent and the increased capacity will be three times that of UAT's current bumping capacity.
The new "Flip-Chip packaged ICs" are expected to radically alter the market landscape with new specific motivations that will drive demand for wafer bumping.
Semiconductor manufacturers, which are more commonly referred to as Integrated Device Manufacturers (IDMs), are requiring advanced bumping technologies to support the large scale expenditures in next generation products.
We are excited to come together to offer our customers around the world more choices and flexibility for their wafer bumping needs.
Both gold bumping and solder bumping services are available for customers' advanced packaging technology requirements.
As per the current trends in semiconductor packaging, SMT manufacturers are compelled to come-up with solutions that can address the increasing demands for quality inspection, effective wafer and substrate bumping and better dispensing functionalities.
As one of the first microprocessor manufacturers to innovate with lead-free bumping technology, AMD is continuing its track record of environmental responsibility and customer-centric thinking in how we produce our products," said David Bennett, vice president of strategic manufacturing and alliances at AMD.
Lithography for 300mm wafer-level packaging and wafer bumping is quite different from that for other applications.
If you're put on a flight that arrives within one hour of your original arrival time, you will not receive any bumping compensation.
The new bumping facility, located at 2 Science Park Drive, will have an initial capacity of 8,000 wafers per month, with the potential to reach 30,000 wafers per month in the coming years.
The availability of a commercial source for high quality glass molds is one of the critical aspects of this new bumping technology" states Dr.