The final chapter discusses electronics assembly and includes treatments of elementary subassemblies, chip carrier
assemblies, hybrid microelectronics assemblies, printed wiring board assemblies, and system integration.
PHOTO (1--Color) (Ran in Simi and Conejo Editions only) Kadri Vural, assistant director of electronic-devices research at the Rockwell Science Center in Thousand Oaks, holds a chip carrier
LOS ANGELES, March 8, 2011 /PRNewswire/ -- OFC/NFOEC -- Tektronix Component Solutions announced today its new 30 GHz leadless chip carrier
(LCC) packaging platform to meet the broadband performance requirements demanded by telecommunications systems and modules, military/aerospace applications, and terrestrial communications.
PHOTO : Two plastic packages, the dual-in-line (left) and the plastic-leaded chip carrier
(right), are encapsulated in a thermosetting polymer by means of transfer molding (from Ref.
6- by 5- by 1-mm) surface-mount leadless (SML) chip carrier
package, the HMC6042 eliminates the requirement to assemble and integrate a variety of smaller, individual or discrete components, to complete the analog portion of such devices.
The Windeo(TM) RF IC is packaged in a small footprint 92-pin leadless Bump Chip Carrier
(BCC) and supports data rates up to 480 Mbps.
Our goal is to provide a terabit of data through our multi-channel ports, with multiple ports embedded within targeted Flip Chip (FC)-Ball Grid Array (BGA) chip carrier
The HCTL-2017-A00 is a 16-bit counter/quadrature decoder available in the LP package, plastic leaded chip carrier
(PLCC) and lead-free PDIP.
75 mm, 8-pad JEDEC DRP-N LPCC leadless plastic chip carrier
-- the smallest package used for 802.
The new Bumped Chip Carrier
Package (BCC) is only 5 x 5 x 0.
ASAT's 150,000 square foot manufacturing facility in China is currently in production with its Leadless Plastic Chip Carrier
, Thin Array Plastic Package and Fine Pitch Ball Grid Array advanced packages.
rex 541 for use by customers who extrude sheets and films that can be thermoformed to finished components, saying that it is "ideal for applications in several industries": medical--for use in sterilizable trays and equipment; aerospace--meets flame, smoke and toxicity requirements for use in aircraft interior applications; and semiconductor--provides high stiffness and a low coefficient of thermal expansion for use in chip carriers