chip package

(redirected from chip housing)

chip package

The housing that chips come in for plugging into (socket mount) or soldering onto (surface mount) the printed circuit board. Creating a mounting for a chip might seem trivial to the uninitiated, but chip packaging is a huge and complicated industry. The ability to provide more and more I/O interconnections to a die (bare chip) that is increasingly shrinking in size is an ever-present problem. In addition, the smaller size of the package contributes as much to the miniaturization of cellphones and other handheld devices as the shrinking of the semiconductor circuits. See BGA, CDIP, CERDIP, CERQUAD, CLCC, DIP, flatpack, package on package, PLCC, QFP, MCM, MCP, SOP, SOIC, SOJ, TSOP and ZIP.
References in periodicals archive ?
Lanxess recently launched four new compounds for LED chip housings and sockets based on PCT, a new polyester in its product line.
The compounds can be injection molded in a wide processing window; good flow properties are said to allow for chip housings and sockets to be designed with thin walls and slim dimensions.