conduction cooling

conduction cooling

[kən′dək·shən ‚kül·iŋ]
(electronics)
Cooling of electronic components by carrying heat from the device through a thermally conducting material to a large piece of metal with cooling fins.
Mentioned in ?
References in periodicals archive ?
Walter Podbelski, Elma's director of business development, said, "For embedded electronics in mobile applications that require conduction cooling, SureLock not only holds cards securely in place, but facilitates heat transfer as well.
The new 200W PKB4216C employs advanced techniques developed by Ericsson and has been especially optimized for conduction cooling, quickly transporting heat away from system components in applications such as RFPAs.
Designed to be mounted on a cold plate for conduction cooling, the unit also has an optional shrouded heat sink for forced-air cooling.
New applications can be deployed in half the time and cost of traditional conduction cooling.
The superior, lightweight design facilitates conduction cooling by transferring heat from a circuit card to a cold plate or to an enclosure's extruded side walls, and makes the 325 Series highly useful in compact, mobile applications as well.
For more information on fan-less conduction cooling, GE has developed a white paper, which is now available for download.
Whilst passive cooling is still perfectly viable in many applications, this increase in power consumption means that allowances for additional cooling solutions, such as heat spreaders for conduction cooling, must be made.
Approved for patent is a battery tray enclosure, designed to provide a method for thermally managing commercially available battery modules through conduction cooling or heating.
This module sets a new standard for thermal management, shock and vibration by implementing a combination of conduction cooling rails and SODIMM hold down mechanism.
With internal conduction cooling and high-speed backplane connectors, the VPX range of DC/DC power supplies support a nominal 28V DC input (full input voltage range is from 18 to 40V) and implement SynQor's field-proven MilQor Mil-COTS DC/DC converters.
The rugged system platform incorporates a thermally conductive base as well as ribbed top and bottom covers to provide convection and conduction cooling for superior thermal management.
Size, Weight, Power and Cooling (SWAP-C) critical applications benefit from the board s light weight construction, along with minimal power consumption of just 35 watts, plus conduction cooling - withstanding extreme temperatures of -40AC to +85AC.