The ABC550 and MBC550 Series open-frame power supplies for industrial and medical applications deliver up to 550 W in a compact 3 x 5-inch footprint and can be utilized in many conditions, including convection cooled (no fans) up to 150 W, conduction cooling
(heat-sink surface) up to 250 W, or up to 550 W in forced-air-cooled environments.
With its high efficiency, small form factor and convection or conduction cooling
capability, the sealed power supply is ideal for digital outdoor displays, LED lighting, and industrial control or clean room equipment where fan noise or moving air is not acceptable.
is the method of using thermally conductive material to transfer heat from the PCB to a cold wall or heat sink.
The cable load comprises an AIN substrate within an aluminum housing to achieve a good compromise between performance and conduction cooling
and the length of the coaxial cable is customized to suit the specific application.
The conduction-cooled CP3-GESW12M3N delivers the same ease-of-use, features and functionality as the CP3-GESW12M3 plus enhanced environmental protection with conduction cooling
The new 200W PKB4216C employs advanced techniques developed by Ericsson and has been especially optimized for conduction cooling
, quickly transporting heat away from system components in applications such as RFPAs.
is common for applications that are sealed or have little to no airflow and is often used in higher altitude applications such as ATRs.
The ruggedized CP6-GESW24M3N delivers the same ease-of-use, features and functionality as the CP6-GESW24M3 plus enhanced environmental protection with conduction cooling
For more information on fan-less conduction cooling
, GE has developed a white paper, which is now available for download.
5 mm impact resistant polycarbonate case with thermal conduction cooling
The CP3-GESW8N delivers the same ease-of-use, features and functionality as the CP3-GESW8 plus enhanced environmental protection with conduction cooling
and conformal coating.
8 mm units have an impact-resistant, non-vented polycarbonate upper and lower case, and thermal conduction cooling