through a glass carrier wafer made of BOROFLOAT glass is possible thanks to deep UV light transmission at the relevant laser wavelength range.
The Assembly Joint Lab will focus on the development of bonding/de-bonding
, fusion bonding, thermo-compression bonding and reflow bumping technologies to address existing issues such as high throughput and particle-free de-bonding
, high throughput Chip on Wafer (CoW) for 2.
Failure did not occur for seal A, whereas D, E, H and J displayed various amounts of de-bonding
after cycling at -26[degrees]C (temperature specified in CAN/ CGSB-19.
Among the specific topics are polymer adhesive wafer bonding, plasma-activated bonding, wafer-level solid-liquid interdiffusion bonding, temporary bonding to enable three-dimensional integration and packaging, and a thin wafer support system for processing above 250o C and cold de-bonding
The external damage, however, is a result of the external render de-bonding
from the walls, allowing water to enter the property.
The key breakthrough in FlexUPD," ITRI says, "is its simultaneous adhesive and non-adhesive bonding--the use of a de-bonding
layer--between the glass and flexible substrate.
The technology is easily adaptable by panel and display manufacturers and is technologically compatible with mainstream LCD production lines operating now and in the future, and is even compatible with old generations of LCD makers, with manufacturers only adding the de-bonding
equipment to incorporate the FlexUPD, ITRI said.
A specialist team of police from Bridgend were called to cut the protesters free and "de-glue" with a de-bonding
and Peter Bain and Giovanni Manfre, De-Bonding
In addition to highlighting its Sand-Lion 3-in-1 Systems that combine casting heat treatment, thermal sand de-bonding
and thermal sand reclamation, CEC's GIFA exhibit is focused on a patent-pending technology that combines thermal sand reclamation with shell sand re-coating.
Combined with SUSS MicroTec equipment, the total solution offers the benefits of simple bonding using standard manufacturing methods and provides compatibility with thermal and chemical requirements for via middle and interposer TSV processing, as well as faster room temperature de-bonding
required for advanced packaging applications.
Furthermore, temporary bonding and de-bonding
also could be applied in the process of light weight and wearable device in the future.