dicing


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dicing

[′dīs·iŋ]
(electronics)
Sawing or otherwise machining a semiconductor wafer into small squares, or dice, from which transistors and diodes can be fabricated.
References in periodicals archive ?
The Optium ADS(TM) 160 Dicing System provides superior performance for applications such as wafer split/trim, row slice, dice, and relief cut applications.
The WDF DP can be used as either wafer prober or as a dicing frame handler.
CORWIL has been one of the leaders in wafer dicing since 1990 and provides IC assembly, wafer dicing and visual inspection services for hundreds of semiconductor companies.