dry plasma etching

dry plasma etching

[¦drī ′plaz·mə]
(electronics)

dry plasma etching

A method for inscribing a pattern on a wafer by shooting hot ions through a mask to evaporate the silicon dioxide insulation layer. Dry plasma etching replaces the wet processing method that uses film and acid for developing the pattern.
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An innovator of advanced wafer-thinning processes and applications, Tru-Si will utilize its processing knowledge and proprietary equipment for dry plasma etching to produce silicon wafers that are thinned to 100 microns or less.