edge bead

corner bead, angle bead, angle staff, corner guard, corner molding, plaster bead, staff bead

corner bead, 2
1. Any vertical molding, usually a plain, filleted, or quirked bead, used to protect the external angle of two intersecting surfaces.
2. A strip of formed galvanized iron, sometimes combined with a strip of metal lath, placed on corners before plastering to reinforce them.
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References in periodicals archive ?
The edge shape and the neck-in value are almost the same between both die widths, which shows that the die width does not affect the neck-in and edge bead phenomena in these cases.
Epoch die for extrusion coating, meanwhile, will feature the new Edge Bead Reduction (EBR) internal deckle mechanism that reportedly eliminates edge-trim scrap.
This will maximize the user's ability to detect particles, pits and residues that lead to hot spots on the front side, chips, cracks, and scratches that cause wafer breakage, and edge bead removal issues that not only harm the individual wafer, but can result in equipment and wafer cross contamination.
Inaccurate wafer centering during the edge bead removal (EBR) process leads to mis-alignment of the edge exclusion region, the distance from the edge of the wafer to the edge of the active die area.
The EXi Series also automatically performs Edge Bead Removal (EBR) and Wafer Edge Exclusion (WEE) metrology.
The rising demand for high-performance devices with improved speed and capacity has positively impacted the demand for silicon, reflective coating, contrast enhancers, edge bead removers, primers or adhesion promoters, specialty solvents, and etchants.
com/prnh/20130307/600769) 'Photoresists (g-line and i-line, KrF, ArF Dry, ArF Immersion) and Photoresist Ancillaries (Anti-reflective Coatings, Photoresist Developers, Edge Bead Removers and Others) Market for Semiconductors & Integrated Circuits, Printed Circuit Boards and Other Applications - Global Industry Analysis, Size, Share, Growth, Trends and Forecast, 2014 - 2020' Photoresists are light-sensitive materials that are primarily used in fabrication and packaging of semiconductors, integrated circuits, flat panel displays and printed circuit boards.
has developed enhancements to extrusion coating dies and internal deckles that make it possible for converters to reduce edge bead with low-melt-strength polymers while maintaining coat-weight uniformity--two goals that reportedly have often been mutually exclusive with such resins.
The Flex-Master's 65 mm and 75 mm coextrusion station utilizes a feedblock and 1,500 mm die with internal deckles for edge bead savings.
The ACS300 module offers closed cover coating technology and best-in-class edge bead removal precision and therefore enables optimum thick resist processing for 3D integration processes.