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A manufacturing plant that makes semiconductor devices. Many chips are created by "fabless" companies that take their tested designs to a fab for production. Examples of fabs are Intel, Samsung, Renesas (Hitachi-Mitsubishi merger), Texas Instruments, Toshiba, Infineon, STMicroelectronics, NEC, Freescale and Philips.

Be the First on Your Block
You too can be a chip maker. All it takes is roughly USD $5 billion to build a state-of-the-art facility. See process technology.


On drawings, abbr. for “fabricate.”
References in periodicals archive ?
Risks that may cause these forward-looking statements to be inaccurate include among others: unexpected delays in the production of 56-nanometer NAND flash products at Fab 3, unexpected delays in completion of Fab 4 or in the ramp-up of 56-nanometer NAND flash production at Fab 4, once completed, inability to meet higher performance specifications, higher than expected costs and the other risks detailed from time-to-time under the caption "Risk Factors" and elsewhere in our Securities and Exchange Commission filings and reports, including, but not limited to, Form 10-K and our quarterly reports on Form 10-Q.
In return, Macronix agreed to make certain commitments, including loading of Fab 2.
The fab will feature the industry's most advanced 300mm automation and manufacturing systems to support the next generations of process technologies.
0 product conforms to all relevant standards for 300mm fab operation, including SEMI's CIM Framework, and follows the Technology Roadmap for Semiconductors.
Currently, AMD is successfully ramping 65nm process technology in Fab 36, and revenue shipments remain on track for the fourth quarter of 2006.
The core activity of the Kulim fab is to produce power semiconductors which enable efficient energy management, such as CoolMOS and IGBT chips for industrial applications and SMART-Power chips for use in cars.
Fab 4 is expected to come on line in the fourth quarter (Oct-Dec) of 2007, with an initial capacity of 2,500 wafers a month.
I've been tracking wafer fab metrics for more than 20 years and I've never seen a year like this one," reflected George Burns, SMA president.
AMD will ramp down 200mm manufacturing in the second half of 2007, with preparation already underway for the ramp of 300mm wafers on 65nm process technology at Fab 38 by the end of 2007.