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first-level packaging

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first-level packaging [‚fərst‚lev·əl ′pak·ij·iŋ]
(electronics)
Electronic packaging which provides interconnection directly to the integrated circuit chip.


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The first tier will include microelectronics services and backend wafer fab; the second tier will be first-level packaging (single chip and multichip); tier three is second-level packaging (board level) and tier four is system-level packaging (box or product level).
This next-generation technology entails inverting the chip at first-level packaging by means of solder bumps, which both mount and connect the chip to the single- or multi-chip module.
This next-generation technology inverts the chip at first-level packaging utilizing solder bumps as a means for both mounting and connecting the chip to the substrate (single- or multichip module).
 
 
 
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