The first tier will include microelectronics services and backend wafer fab; the second tier will be first-level packaging
(single chip and multichip); tier three is second-level packaging (board level) and tier four is system-level packaging (box or product level).
Packaging of the integrated circuit chip, which forms the foundation of the modern electronic computer, is referred to as first-level packaging
Packaging (Discrete packaging, Zero and first-level packaging
, Wafer Level Packaging, other packaging techniques such as 3D).
This next-generation technology entails inverting the chip at first-level packaging
by means of solder bumps, which both mount and connect the chip to the single- or multi-chip module.