flip chip


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flip chip

[′flip ‚chip]
(electronics)
A tiny semiconductor die having terminations all on one side in the form of solder pads or bump contacts; after the surface of the chip has been passivated or otherwise treated, it is flipped over for attaching to a matching substrate. Also known as solder-ball flip chip.

flip chip

A chip packaging technique in which the active area of the chip is "flipped over" facing downward. Instead of facing up and bonded to the package leads with wires from the outside edges of the chip, any surface area of the flip chip can be used for interconnection, which is typically done through metal bumps of solder, copper or nickel/gold. These "bumps" or "balls" are soldered onto the package substrate or the circuit board itself and underfilled with epoxy. The flip chip allows for a large number of interconnects with shorter distances than wire, which greatly reduces inductance.


Wire Bond Vs. Flip Chip
In the wire bond method (top), the die faces up and is attached to the package via wires. The flip chip (bottom) faces down and is typically attached via solder bumps similar to the larger ones that attach BGA packages to the printed circuit board (also shown here). (Image courtesy of Amkor Technology, Inc.)
References in periodicals archive ?
At stake is a big market: Total flip chip sales, including assembly, packaging and test, reached $16 billion in 2010, Yole said, good for 29% of the worldwide IC market.
In addition to PoP, this technology could be used for the bottom flip chip package, attaching the flip chip die to the package via copper pillars on substrate instead of copper posts on die (Figure 5).
These die placers, combined with recent advances in wire bonding equipment permitting extremely accurate wire length, loop height and loop shape control, permit COB with wire bonding to compete with flip chip in RF applications where the accuracy of the parasitic reactances at each I/O pad of the die is a factor in the overall design.
ASAT's flip chip LGA offers an exceptional solution for our multimedia products, and we are confident we will meet our customer needs for quality, performance and reliability.
Face-down wired flip chip technologies are covered along with an area array tape-automated bonding type of flip chip.
Flip chip with no underfill is less of an issue, but either can be accommodated.
While a tremendous amount of research and development effort is being directed at using flip chip bump technology as an interconnect method, there are several process and reliability issues to be addressed before flip chip can be utilized as a mass production interconnect technique across the industry.
To-date, our lead free technology has supported the production of more than 150 million devices for mobile applications," said Mike Barrow, SVP of Amkor's flip chip business unit.
reportedly told DigiTimes that demand for flip chip substrates will be over 10 million units per month, 70 to 80% of which could be consumed by ATI Technologies and Nvidia combined.
We established this factory in collaboration with Chartered Semiconductor Manufacturing and other Common Platform customers operating in Singapore to support the growing adoption of flip chip packaging for advanced silicon," said Oleg Khaykin, Amkor's executive vice president and chief operating officer.
Austin, TX -- Flip chip and wafer level packaging will see a compound growth rate of 28% between 2004 and 2009, a new study projects.
Successful commercialization of next generation semiconductor technology requires not only advanced silicon, but also the combination of appropriate assembly and test technologies and proven manufacturing scale," said Mike Barrow, Amkor's senior vice president, flip chip business unit.