known-good die


Also found in: Medical.

known-good die

[‚nōn ¦gu̇d ′dī]
(electronics)
An unpackaged, fully tested integrated circuit chip.

known-good die

Chips that have been fully tested before being placed into their packages. Chips used in ceramic-based multichip modules (MCMs) are typically fully tested beforehand, because the ceramic substrates are costly to replace if the final package is faulty because of a bad chip. See MCM and known-good software.
References in periodicals archive ?
The packages were assembled with known-good die, which were bonded with 2.
He said he sees more interest in applying ATPG compression patterns at wafer-sort test to ensure known-good die (KGD) where comprehensive compression patterns can be applied without extensive I/O access at the wafer-probe level.
The availability of known-good die (KGD) at an acceptable price was an issue for other applications.
In addition, contracts have been awarded to Lockheed Martin, Syracuse, NY, for a known-good die intelligent test station; M/A COM for work on the independent merchant foundry source for low cost MCAs for DoD applications, Northrop Grumman for work on adaptable MMICs; the Raytheon/Texas Instruments joint venture for work on technologies for wideband integrated apertures and ground-based AESAs; Texas Instruments for work on enhancement of a source for MMICs and MCAs; TRW Inc.
The major difference is that today's inteposers have TSVs, but some issues, such as ensuring a high-yield process is used to produce the substrate, mounting known-good die, thermal issues, and infrastructure, have not changed.
Typically, memory will come from a third-party memory supplier, arriving as a known-good die and delivered with a test program that validates the die as good.
As part of the agreement, RedMere will provide known-good die (KGD) connectivity products for the HDTV and consumer multimedia markets to Fairchild.
We also offer CellularRAM products in known-good die (KGD) wafer formats so that memory subsystems can be tuned to specific application requirements, such as integration into multi-chip package solutions.
In addition, the use of film frames allows probing to take place after wafers have been sawed to insure delivery of known-good die in cases where extremely fragile die could be damaged during wafer dicing.
This will decrease the cost of manufacturing packaged ICs and allow production of lower-cost and higher-reliability Known-Good Die, a critical requirement for multi-chip modules.